Portugal is reinforcing its position in the European semiconductor and microelectronics landscape through the Microelectronics Agenda, a mobilizing project funded by the Portuguese Recovery and Resilience Plan (PRR) and the European Union’s NextGenerationEU.
Led by Amkor Technology Portugal, the consortium of 17 partners — including companies, research centers, and technology organizations — focuses on key areas such as advanced packaging, photonics, communication systems, and industrial innovation. Building on its initial achievements, the Agenda now presents a new set of products and prototypes that demonstrate Portugal’s growing capacity for microelectronic design and manufacturing.
Exatronic Lda. has contributed with a diverse range of embedded and communication modules that enhance control, automation, and interaction in various industrial and consumer applications. Among its developments are advanced 4G/5G communication boards enabling wireless connectivity, capacitive “touchless” interfaces for safer and more intuitive user interaction, and efficient power management solutions such as the PMP10698 buck-boost converter for USB Type-C systems. The company has also created versatile audio and control boards — including panels for anti-theft and alarm systems — as well as the ETR3.0 electronic signaling unit for automatic fishing traps and digital lens controllers integrating touchscreens and real-time feedback. Together, these products reflect the company’s strong capacity to integrate electronics and communications into complex and intelligent systems.
In the area of high-speed communication and data processing, HFA - Henrique, Fernando & Alves, S.A. has designed high-performance hardware for test and telecommunications infrastructures. This includes signal acquisition and processing modules for automated test systems and advanced boards for backbone network equipment such as routers and optical switches. Incorporating SFP/SFP+ ports and FPGA-based packet processing, these systems handle large data flows with low latency, reinforcing Europe’s digital infrastructure and technological independence.
Research and development activities at INESC MN complement these industrial advancements through pioneering work in microfabrication and spintronic sensors. The institute has successfully produced 8-inch silicon wafers featuring tunnel magnetoresistive (TMR) thin-film sensors, suitable for current and magnetic field sensing, position control, and biomedical applications. Additionally, it has developed 6-inch microfabricated silicon wafers designed for the hybrid integration of photonic chips, enabling precise assembly of optical and electronic components with sub-micron tolerances — a key step for next-generation photonic systems.
PICadvanced has contributed with its expertise in photonic integrated circuits (PICs), developing optical transceiver modules for next-generation passive optical networks (PON). These devices enable data transmission beyond 10 Gbps, enhancing the performance and scalability of fiber communication systems while supporting Europe’s strategic autonomy in photonics and telecommunications.
Finally, AIDA CCI – Chamber of Commerce and Industry of the Aveiro District, a consortium member, has been attending some of the main international fairs of the industry, where it always takes the opportunity to present and promote the consortium's products, processes and technologies.
Created under the mobilizing agendas of the Portuguese Recovery and Resilience Plan, the Microelectronics Agenda has total eligible funding of €67 493 749,13 by the Recovery and Resilience Plan, through NextGenerationEU. The project runs until june 30, 2026.