ISDI GmbH Austria

The 1412HR is a dynamic X-ray detector designed for electronics inspection, NDT, industrial and pre-clinical
applications, with a pixel pitch of 50 μm and a choice of high-efficiency CsI or Gadox scintillator. It is ideal for
CBCT or fluoroscopy.

This detector employs a state-of-the-art CMOS sensor with 14 or 16-bit digital outputs and two gain modes offering
a high dynamic mode or a high sensitivity mode ideal for low dose, real-time imaging. The sensor is permanently
bonded to a fibre optic plate (FOP) to enhance image quality and make the device more radiation tolerant. The
detector is housed in a low-profile enclosure incorporating lead shielding.

Innovative sensor design enables a frame rate of up to 68 fps can be achieved with Camera Link or GigE. A
programmable region of Interest (ROI) gives higher frame rates, for example with an ROI of 2802 × 1200 pixels
can be read out at 68 frames per second.

For developers, an SDK is available with DLLs for 64-bit Windows and Linux. These include C++ and .NET
wrappers for easy integration with customised software. Library functions include dark subtraction, gain correction
and defect correction. Example code is provided, including a simple Graphical User Interface. The SDK supports
Camera Link, GigE and USB communications.

Key Features:

• Fast, low noise imaging with minimal image lag
• CMOS sensor bonded to fibre optic plate (FOP)
• High Sensitivity and High Dynamic Range modes
• High speed, flexible region of interest
• Choice of high resolution / high sensitivity CsI scintillator
• Windows and Linux SDK available for rapid design-in

The 2824HR is a dynamic X-ray detector designed specifically for industrial NDT, pathology and other CT
applications such as X-ray diffraction, with a pixel pitch of 50 μm and high-resolution CsI or Gadox scintillator. This
detector employs a state-of-the-art high-resolution CMOS sensor with 14-bit digital outputs and two gain modes
offering a high dynamic mode or a high sensitivity mode ideal for low dose, real-time imaging.

The sensor is permanently bonded to a fibre optic plate (FOP) to enhance image quality and make the device more
radiation tolerant. The detector housing has lead shielding to provide protection against radiation damage. The
detector offers a Cameral Link interface enabling 12 fps at full resolution of 5606 × 4800 pixels and a 10 GigE
interface supporting 22 fps. Our built-in customised high-speed USB interface enables the rapid integration of the
detector for demonstration and imaging evaluation.

For developers, an SDK is available with DLLs for 64-bit Windows and Linux. These include C++ and .NET
wrappers for easy integration with customised software. Library functions include dark subtraction, gain correction
and defect correction. Example code is provided, including a simple Graphical User Interface. The SDK supports
Camera Link, 5 GigE and USB 3.0 communications.

Key Features

• Fast, low noise imaging with minimal image lag
• CMOS sensor bonded to fibre optic plate (FOP) for radiation tolerance
• High Sensitivity and High Dynamic Range modes
• High speed, flexible region of interest
• Choice of high resolution / high sensitivity CsI scintillator
• Windows and Linux SDK available for rapid design-in
   

The 1615HE is a dynamic X-ray detector designed for high-speed electronics and semiconductor inspection, with a
pixel pitch of 75 μm and a choice of high-efficiency or high resolution CsI, it is ideal for inline x-ray inspection.
Innovative sensor design enables a frame rate of up to 80 fps and higher speeds in region of interest modes. The
flexible region of interest function allows a region to be configured to optimise the frame rate.

This detector employs a state-of-the-art CMOS sensor with 16-bit digital outputs and two gain modes offering a
high dynamic range and a high sensitivity mode with extremely low read noise, which is ideal for low dose, real-time
imaging. The sensor in encapsulated with a lead-shielded enclosure offering high tolerance to radiation damage.
The detector does not require any external shielding.

For developers, an SDK is available with DLLs for 64-bit Windows and Linux. These include C++ and .NET
wrappers for easy integration with customised software. Library functions include dark subtraction, gain correction
and defect correction. Example code is provided, including a simple Graphical User Interface. The SDK supports
Camera Link and GigE communications.

Key Features

• Fast, low noise imaging with minimal image lag
• CMOS sensor bonded to optional fibre optic plate (FOP)
• High Sensitivity and High Dynamic Range modes
• High speed, flexible region of interest for panoramic imaging
• Choice of high resolution / high sensitivity CsI scintillator
• Windows and Linux SDK available for rapid design-in

Made to Measure

Designers of imaging systems often have very specific requirements – for example, a specific size, pixel spacing, sensitivity or frame rate, which cannot be provided by the limited selection of CMOS image sensors on the market.
To fill this gap, ISDI provides a complete service for the design and production of custom image sensors.  We specialise in small to medium size volumes, where the mainstream semiconductor sensor vendors cannot offer an economically viable solution.

Our technology portfolio includes: 

• Pixel sizes varying from 5 μm to 200 μm pitch
• 3-side butting on all standard sensors for tiling into large arrays
• Per-column ADC, 10 -16 bit
• Pixel architectures from NIR to UV
• Radiation-hard design
• Unique linear pixel techniques providing dynamic range >90 dB
• Dual- or triple-well pixel architecture
• Dynamically assigned ROIs
• Non-destructive readout (NDR)
• Correlated double sampling (CDS)
• Proven designs in technologies 180 nm – 350 nm
• Fibre optic plate (FOP) bonding
• Complete camera/detector designs: Camera Link, 10 GigE and USB3.1 connectivity
• Expertise in scintillator technologies

BergKristall – High-Resolution CIS for Demanding Inspection Tasks

BergKristall was a custom design project for Tichawa Vision GmbH. It is a dual-resolution Contact Image Sensor designed for applications such as print inspection, semiconductor manufacturing, and flatness detection. It features a two-size 4T pixel array with resolutions of 1200 dpi and 4800 dpi, optimized for varying detail requirements. The sensor integrates FPGA-based processing, a gapless optical design, and flexible light source control to ensure accurate color and grayscale measurements, supporting speeds up to 400 m/min.

A key feature is the precise alignment of RGB pixels, improving image quality over traditional Bayer or tri-linear sensors. Shape-from-Shading functionality is supported in a compact form factor, with high-speed capability and an optical design that minimizes stray light. Advanced image correction features, including banding compensation, contribute to reliable performance in critical inspection environments.

The analogue front end includes a ramp ADC with correlated double sampling, while on-chip digital logic enables efficient data handling through selectable Regions of Interest and 8:1 multiplexing. Data output is delivered via 8 LVDS channels at up to 1 Gbps each. The sensor die measures 21 × 4.72 mm², designed for seamless tiling in wide systems.

BergKristall offers a robust and precise solution for high-speed, high-resolution inspection across various industrial applications.

Web Inspection with BergKristall Sensor Chip: Applications & Insights

RSP Systems aimed to replace its off‑the‑shelf CCD sensor with a more compact, cost-effective solution to support non‑invasive glucose monitoring via Raman spectroscopy. Faced with the challenges of detecting weak NIR signals under long exposures, they partnered with ISDI to co‑design a custom CMOS image sensor. Throughout the collaboration, ISDI and RSP iterated designs using bring‑up boards and lab characterisation, refining power grids to suppress dark noise and integrating microlenses to boost quantum efficiency in the 840–960 nm band.

The resulting sensor features on‑chip timing logic, column‑parallel ADCs, and a direct SoC interface (eliminating the need for an FPGA), all packaged in a minimized footprint to support future wearable form factors. Despite tight constraints on cooling and component count, the final module met requirements for sensitivity, noise performance, and compactness in time for RSP’s clinical trials. RSP continues to collaborate with ISDI on next‑generation, wearable glucose monitoring devices using the same sensor architecture.

For more about our ISDI’s custom design services take a look here: ISDI Custom Image Design Services