Sojitz Machinery Europe GmbH

DAWON NEXVIEW CO., LTD., is Korea-based company providing Laser Based Automation System Development & Manufacturing.

Dawon offers the following equipment during SEMICON EUROPA:

①High Speed Bonder System is the system to bond the pin to the instructed position after dipping the pin at loading tray onto the solder paste by real-time visual inspection and join, mount Probe  (60μm pitch) more than 10,000 pices per day with very high performance level namely Bonding Accuracy ≦ +/-4μm.

②Laser Jetting system is the system to repair Micro Solder ball (40～80μm) mixed at the process of final production of SoP (Solder on Pad) for Enlarged and Multi-layered PCB (such as FC-BGA：Flip Chip=Ball Grid Allay) which is gworing in High-spec GPU / CPU for HBM (High Bandwidth Memory) chip by Laser technology with 1ea unit size and bond Micro Solder Ball with very high speed (>6 balls / sec) during SoP process for products such as MObile, PCB and FPCB.

Bando Chemical Industries, Ltd. is Japan based company that manufactures products for Automotive, Industrial, Multimedia, Electronics (including Optoelectronics).

Bando offers  ​FlowMetal™, an advanced nano-silver sinter paste engineered for high-reliability die attach applications.

​FlowMetal™ enables low-temperature, pressureless sintering, providing a robust and reliable bonding solution for power semiconductor devices such as SiC and GaN operating in high-temperature environments. After sintering, FlowMetal™ forms a dense silver bond layer with minimal porosity, delivering excellent thermal conductivity and low electrical resistance—comparable to bulk silver.

Key Features of FlowMetal™  are Pressure-free, Low-temperature sintering, High joint strength and chip bonding reliability, Excellent workability and cost efficiency, Stable and consistent printing performance, Superior heat resistance, High thermal and electrical conductivity.

Achilles Corpotation is Japan based company who is manufacturer of Wafer Cases and SED materials.

Achilles offers following products during SEMICON Europa：

①Conductive heat-resistant tape for electrostatic chucks, featuring a silicon/heat-resistant acrylic adhesive on a PI or PEN substrate with Achilles' unique conductive treatment, for enabling chucking of insulating wafers and for reducing applied voltage in electrostatic chucking processes and for protecting wafers in various semiconductor manufacturing processes such as plasma processing, baking, and chemical processing etc.

②Low-adhesion conductive protective film. Made from clean materials, it minimizes effects on wafers such as outgassing and ion contamination, for preventing scratches, dust adhesion, and static electricity generation on FPD screens, and for preventing electrostatic discharge (ESD) caused by peeling, dust adhesion, and foreign object entrapment. Working for protective packaging for display devices such as LCDs, optical films, and optical panels.

③Packaging materials to safely and compactly stores wafers during shipment from front-end to back-end processes using three components: carieer, interleaves, and cushions with it's condition of wafer carrier being conductive, clean, and shock-resistant, protecting wafers from risks such as corrosion, electrostatic discharge (ESD), and damage during transportation. Its compact and stackable design ensures efficient wafer shipping.

Sanyu Rec is Japan-based advanced materials manufacturing company with over 60 years of expertise in resin formulation technology, the company utilizes cutting-edge technology to develop high-quality product.

Sanyu Rec could offer extensive customization options to adjust properties such as high thermal conductivity, adhesion, thermal expansion, and elastic modulus to meet your specific needs.

For Semiconductor industires, they developmet wide range of products, including narrow-gap underfill materials for advanced semiconductor packages, liquid encapsulants for FOWLP, die attach, glass attach materials, and low-expansion encapsulants for CMOS image sensor packages.

For Electricity and Electronic industries, they develop materials such as Potting Resin for PCB, Resin for Automoitive parts, UV Cure Resin and adhesive (one component) type.

MORESCO Corporation is speciality chemical and lubricants company based in Kobe, Japan.

The business filed of MORESCO is Development, Manufacture and Sales of such as functional fluids, synthetic lubricants, liquid paraffin & sulfonates, hot melt adhesive, energy device materials and deliver sustainable one-of-a-kind products into the market as specialist in interface.

In the semiconductor field, demand for PFAS alternatives has been increasing in anticipation of environmental regulations. So from the perspective of reducing environmental impact, MORESCO is actively developing PFAS-free products (Grease, Base oil) which may work for applications such as Semiconductor Manufacturing equipment, Sliding components and Bearing items.