Tohoku-MicroTec Co., Ltd

青葉区荒巻字青葉6-6-40
T-Biz203
仙台市,  宮城県  980-8579

Japan
http://www.t-microtec.com

• Booth: C1804

T-Micro is a foundry specializing in advanced 3D/2.5D-IC.

T-Micro is the unique and advanced 3D/2.5D IC process-oriented foundry with chip level to 12"wafer level integration.    

Three-dimensional LSI is a technology to chipletize SoCs and connect chiplets with many short wires to achieve high speed and high performance.  Since our establishment, we have developed the necessary elemental technologies for 3D integration in-house.  These include TSVs of various sizes and structures, various micro bumps, wafer thinning, and bonding, molding, heterogeneous stacking etc.  We hope to combine these elemental technologies to create new high-performance devices together with you.

 Press Releases

• About T-Micro (20250825)

  T-Micro is a foundry specializing in 3D-IC with chip level to 12" wafer level.

  We have the following distinctive technologies.

  -Sels-assembly Technology for stacking LSI chips on wafers (CoW) at ultra-high speedand high precision Expected application:  Cost reduction of 3D stacking ,  chiplet integration and mass transfer for mini/u-LED                                                        display,  Large panel level assembly

  -Small pitch (less than 5 μm pitch) gold cylinder bumps with repair function

   Expected application:  semiconductor sensor / detector with high space-time resolution