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IntlVac Thin Film Inc.

247 Armstrong Avenue
Halton Hills,  ON  L7G 4X6

Canada
http://www.intlvac.com
  • Booth: B1916


Providing Technology Solutions

Intlvac Thin Film is a leader in advanced vacuum deposition and nanofabrication solutions, serving industries at the forefront of photonics, aerospace, quantum, and materials research. A cornerstone of its innovation portfolio is the Lithium Niobate Foundry, offered as both a service and an integrated cluster tool. This turnkey system combines the Aegis DLC for durable etch masks, the Nanoquest II for precision nanostructuring, and the Nanochrome IV for robust pattern transfer, creating a complete, plug-and-play laboratory for Lithium Niobate device fabrication. Leveraging the unique electro-optic and nonlinear properties of LiNbO₃, Intlvac enables breakthroughs in optical communications, sensing, and quantum photonics. With a focus on reliability, scalability, and performance, Intlvac empowers researchers and innovators to accelerate discovery and production in next-generation photonic technologies.

 Products

  • Icarus - Indium Bump Deposition
    Intlvac’s Icarus Indium Bump Deposition system delivers unmatched control, purity, and uniformity for advanced device interconnects. Ideal for high-volume applications in microelectronics, microLEDs, flip-chip bonding, and optoelectronics....

    • Intlvac’s Icarus Indium Bump Deposition System delivers precision-engineered performance for advanced device interconnects in microelectronics, microLEDs, flip-chip bonding, and optoelectronics. Designed for both production and R&D, Icarus enables defect-free, flat-topped indium bumps from 1 µm to >40 µm in as little as 100 minutes for 4 µm bumps. Its substrate temperature control from ambient to –100 °C ensures uniformity and adhesion across delicate wafers, while deposition rates exceeding 70 Å/s remain virtually spit-free. The system’s high lift-off yield and automatic wafer transfer—available in single or multi-wafer cassette configurations—optimize throughput and repeatability. With exceptional control, purity, and reliability, Icarus sets a new standard for indium deposition performance in next-generation electronic and photonic manufacturing.
  • Lithium Niobate Foundry
    Lithium Niobate (LiNbO₃) powers modern photonics—enabling high-speed data, lasers, and quantum tech. Intlvac’s LiNbO₃ Foundry, featuring Aegis DLC, Nanoquest II, and Nanochrome IV, delivers a turnkey lab for advanced device fabrication....

    • Intlvac’s Lithium Niobate Foundry is a turnkey solution for advanced photonic device research and fabrication, offered both as a service and as a fully integrated cluster tool. This system unites three precision-engineered technologies: the Aegis DLC, providing durable etch masks; the Nanoquest II, enabling high-aspect-ratio etching for complex nanostructures; and the Nanochrome IV, delivering precision nitride and oxide thin films for robust pattern transfer. Together, they form a seamless, plug-and-play laboratory that accelerates development from concept to prototype. Intlvac’s foundry empowers researchers and innovators to explore, design, and fabricate next-generation Lithium Niobate photonic devices with exceptional control, repeatability, and throughput.
  • Athena - Broad Beam Delayering
    The Athena Nanoquest I meticulously deconstructs or "delayers" wafer-level integrated circuits uniformly and with ease. This state-of-the-art tool is crucial for failure analysis and reverse engineering of IC devices....

    • Intlvac’s Athena Nanoquest-I Broad Beam Delayering System delivers precise, contamination-free material removal for advanced IC analysis and device preparation. Using Ion Beam Etching (IBE), it physically sputters away metals, alloys, semiconductors, insulators, and multilayer composites with nanometer-scale precision. By controlling ion energy, current density, and incidence angle, Athena ensures uniform etching with less than 1% non-uniformity, preserving the native state of delicate materials. Unlike mechanical or chemical methods, IBE minimizes heat, radiation, and residue, maintaining measurement integrity. Material selectivity is enhanced through optimized feed gases, enabling targeted etch rates and planarized surfaces without polishing slurries. Designed for reliability and repeatability, Athena provides a universal, high-precision delayering solution for semiconductor R&D and failure analysis.

Categories

200 Packaging and Assembly Equipment
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
    • 204 MEMS Equipment
  • Deep RIE etching; Dry Etching
    • 207 Process Equipment
  • Bumping Systems
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
  • Ion; E-Beam Milling Etching Equipment
    • 300 Packaging and Assembly Materials
  • Thin Film; Dielectric Film Materials
    • 304 Mask Making Materials
  • Transfer lithography masks; Polymer masks; templates (for Nanoimprint)
    • 307 Process Materials
  • Plasma; Ion Sources
    • 700 Manufacturing Services
  • Deposition Service
  • Etch; Strip; Cleaning Service
  • Failure Analysis and other Analytical Services
    • 701 Manufacturing Services or Consulting
  • Technical Intelligence; Reverse Engineering
    • 901 Printed, Organic, Flexible and Large Area
  • Equipment: Vacuum deposition
  • Services: Research and Development
    • 904 Electronic Applications
  • Healthcare: sensors
  • Imaging: Optics and Micromechanic

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