Hummink will present the BIRD module (Breakthrough Integration and Resolution in Defect Repair) at SEMICON Europa 2026, November 10-13 at Messe München (Hall C1, booth 1370).
BIRD is the first industrial HPCaP solution for micro-scale deposition. It prints from 0.6 to 50 µm and covers localized material deposition, defect repair and surface functionalization. It handles inks up to 250,000 cP on glass and a wide range of substrates. The process is additive and maskless, followed by local laser sintering, which reduces material and chemical consumption.
BIRD addresses advanced packaging, notably FOPLP, as well as AI and multi-chip architectures. The module is already running on a pilot line at a major semiconductor and display manufacturer in Asia.