H.C.Starck, Inc.

Newton,  MA 
United States
http://www.hcstarcksolutions.com
  • Booth: 1222


H.C. Starck – A Leading Supplier of Thin Film Materials!

H.C. Starck Solutions' sputtering targets enable consumer and industrial electronic products: HD and UHD TVs, smart phones and mobile devices. H.C. Starck offers planar and rotary sputtering targets from molybdenum, tungsten, tantalum, and niobium for thin film coating applications.

Flat panel, touch panel, semiconductor, and PV manufacturers value H.C. Starck Solutions' sputter targets for their high purity, uniform microstructure, low resistivity, high power density, and superior sputtering performance.

H.C. Starck Solutions additionally offers crucibles and hot zones for crystal growth systems, LED phosphors production and optical coatings; heat sinks for optoelectronic devices, collector rings, wafer carriers and heaters for MOCVD/MBE for the LED manufacturing process.

H.C. Starck Solutions provides their global customer base with local sales and technical support teams.

H.C. Starck Solutions' knowledgeable staff is pleased to exhibit at FPD China and invites you to visit Booth to discuss your thin film requirements.


 Products

  • Tantalum Sputtering Blanks
    High purity tantalum sputtering blank with very stable, thermal, electrical, and mechanical properties for a broad range of semiconductor applications....

  • H.C. Starck Solutions casts tantalum ingots, forges billets, rolls, plates, and machines the parts to final dimensions as sputtering target blanks.

    Dimensional capabilities: 

    • Target diameters up to 750 mm
    • Thickness up to 18.5 mm
    • Co-development with customers could lead to custom part sizes
  • Tungsten Sputtering Blanks
    High purity, high density, and low oxygen tungsten sputtering blanks that meet customers' stringent requirements in high purity, ultra fine grains, and uniform texture for advanced semiconductor applications....

  • H.C. Starck Solutions tungsten target blanks are manufactured using high purity powder and proprietary consolidation and thermal mechanical processing to ensure highest material purities of up to 5N.

    Dimensional capabilities:

    • Width up to 650 mm
    • Thickness up to 10 mm
    • Co-development with customers could lead to custom part sizes
  • Thermal Management Components
    H.C. Starck Solutions provides a variety of critical components for various electronics applications, including ion implantation and thermal management solutions....

    • Pure molybdenum and tungsten heat sinks for telecommunication and consumer electronics
    • Molybdenum-copper composites for transportation electronics
    • Tungsten-copper composites for high voltage circuit breaker systems
    • CuMoCu & NiMoNi laminates for energy applications
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