Applications
RCA cleaning, GATE cleaning, oxide etching and removal, photoresist stripping
Wafer size
300mm
Application of Wet Cleaning Processes:
Particle removal
Metal contamination removal
Organic contamination removal
Photoresist stripping
Pre-cleaning and Post-cleaning
Oxide etching and removal
Al interconnect cleaning
Cu interconnect cleaning
Features & configurations:
● WPH:300
● 8 chambers
● 4 FOUP
● Chemicals(Ex): DHF,SC1,SC2,DIO3,DICO2,IPA,
● Backside Protection: Option, 3ea nozzles
● Heating control, concentration control, flow rate control, pressure control et al.
● SECS/GEM communication