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IZMO Microsystems PVT Ltd

51,52, EPIP, KIADB export promotion, Whitefield
Bengaluru,  Karnataka  560066

India
https://www.izomicro.com
  • Booth: H8A05


izmomicro - Custom SiP & Advanced IC packaging

izmo micro, a venture by izmo Ltd., focuses on providing advanced semiconductor packaging and System-in-Package (SiP) solutions through its cutting-edge facility in Bangalore. As one of the few fully integrated SiP manufacturers in India, izmo micro serves high-performance industries such as consumer electronics, automotive, telecommunications, and green energy.

Technical Highlights:

  • Comprehensive SiP & IC Packaging Solutions: Expertise in custom high-density, high-performance SiP for complex mixed-technology systems.
  • Advanced 3D Packaging Capabilities: Specialization in 3D die stacking, flip-chip, fine-pitch wire bonding, and multi-chip module (MCM) assembly.
  • Class 1000 Cleanroom Facility: High-precision die placement, thick film hybrid substrate manufacturing, and auto-molding processes.
  • High-Reliability Components: RF & microwave assemblies, co-packaged optics, and power modules designed for EV and green energy applications.
  • Diverse Packaging Options: From leaded and leadless packages (DIP, PQFP, QFN, BGA) to specialty ceramic packages (CQFP, CPGA, CBGA).

Aligned with India’s "Make in India" initiative, izmo micro is poised to meet the growing demands of the semiconductor industry 

 Products

  • SiP & IC Packaging, PCB, Box Build Assembly
    Custom SiP & IC Packaging for high-density, high-performance systems....

    • izmoMicrosystems (IMS) is India's pioneer ATMP, OSAT company specializing in System-in-Package (SiP) miniaturization, with India based facilities for 3D packaging & SMT manufacturing.

    The only company with a diverse range of offerings for embeeded design, manufacturing and sustenance solution.

    IMS was established in 1995 in Bangalore, India, acquired niche technology companies and re-positioned itself as Izmo Microsystems.

    Our 30 years of portfolio include all types of BGA, FCBGA, QFN, QFP, CoB, Hybrid Microcircuits, RF telecommunication, MEMS & Co-Packaged Optics.

    We are into India's Semiconductor Mission colloborating with top academia's and industry bodies.

  • System-in-Package
    Custom SiP for high-density, high-performance systems...

    • izmomicrosystems has pioneered several type of IC packaging Technologies.

    • Flip Chip Packages
    • Wire Bond Packages
    • Chip Scale Packages
    • Multichip Modules (MCM)
    • Hybrid Microcircuits
    • System in Package (SiP)

Categories

402 PV Systems
  • Chargers, Batteries
  • Inverters
  • Stand-Alone Systems
    • 500 Factory Monitoring & Control Systems (FMCS)
  • Data Collection; Building control systems
  • Emergency (fire) & Security Control Systems
  • Gas and Other Generation Systems
  • Process Controls
    • 501 HVAC, Temperature, Humidity, Contamination Control
  • Clean Rooms
  • Contamination Control; HEPA Filtering Systems
    • 700 Manufacturing Services
  • Failure Analysis and other Analytical Services
  • Parts Cleaning; Micro Contamination
    • 701 Manufacturing Services or Consulting
  • Assembly
  • Circuit Design; Electronic Design Services (EDS); System Level Design (SLD)
  • Equipment; Hardware; Product Design, Integration and Manufacturing
  • Manufacturing Process Support and Development
  • Nanotechnology Intellectual Property Development; Research
  • Package Materials; Interconnect; Subcomponent; Subassembly Design Services
  • Package Simulation; Characterization Services
  • Product Development; Software Design; Product Lifecycle Management
  • Technical Intelligence; Reverse Engineering
  • Wafer Fab Operations and Design
    • 901 Printed, Organic, Flexible and Large Area
  • Device Manufacturing: Batteries
  • Device Manufacturing: Display
  • Device Manufacturing: Electronic
  • Device Manufacturing: Integrated systems
  • Device Manufacturing: Lighting
  • Device Manufacturing: Photovoltaic
  • Device Manufacturing: RFID
  • Device Manufacturing: Semiconductor
  • Device Manufacturing: Sensors
  • Device Manufacturing: Signage
  • Device Manufacturing: Wearable electronics
  • Materials: Substrates, encapsulation, packaging
    • 903 Electronic Components
  • Components: Low Power Electronics
  • Components: ASIC's
  • Components: Flexible Electronics
  • Components: IC's
  • Components: IDM / Foundries
  • Components: MEMS
  • Components: Sensors
  • Design: CAD Tools
  • Design: Design House
  • Design: Fabless
  • Design: Modelling
    • 904 Electronic Applications
  • Energy Efficiency: High voltage solutions
  • Energy Efficiency: Low Power Electronics
  • Energy Efficiency: Power electronics
  • Energy Efficiency: Power Supplies and Batteries

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