Canon Singapore Pte Ltd

Canon has achieved the *highest level of productivity (throughput) among all equivalent class i-line Lithography Equipment. FPA-5550iZ2 steppers optimize alignment, exposure & wafer transfer sequences, shorten wafer lot exchange times and speed up measurement and calibration processing to reduce wafer processing times.

FPA-5550iZ2 steppers can apply a Shot Shape Compensator (SSC Unit) to enable intrafield correction of vertical and horizontal magnification differences and skew (shot distortion in diagonal orientation) within each exposure field. The SSC Unit employs original Canon technology in the projection optical system that allows improved matching to underlying layers and improved overlay accuracy.

*Among equivalent class of i-line steppers, as of December 14, 2016 (Examination by Canon). FPA-5550iZ2 throughput is improved approximately 20% compared with the standard performance of the previous FPA-5550iZ stepper (exposure condition: 300 mm wafer, 96 shots, 1000 J/m2).

For more information, please visit https://global.canon/en/product/indtech/semicon/fpa5550iz2.html

FPA-6300ES6a scanners deliver high productivity and accuracy by speeding up the exposure process with a new-design Reticle & Wafer Stages, improving alignment sequences and wafer handling time reduction. The throughput of the FPA-6300ES6a is over *200 wph (wafers per hour) which is 1.6 times higher productivity than previous FPA-6000ES6a model scanners.

* 300 mm (12 inch) wafer, 98 shots, with Options applied

To minimize overlay misalignment & intrafield distortion during exposure, advanced stage vibration & synchronous control technologies were adopted in the FPA-6300ES6a. The alignment scope was also improved in order to measure the alignment marks on a wafer more accurately.

Furthermore, by accurately controlling the temperature of the exposure area and the reticle area, **industry-leading Mix & Match overlay accuracy of ≤ 5nm has been realized.

**as of December 14, 2016 (Examination by Canon), with Options applied

The FPA-6300ES6a platform provides substantial improvements in terms of base durability and maintenance requirements, as well as reduced install times and increased system uptime and availability when compared to earlier FPA-6000 Platform scanners. FPA-6300ES6a options and upgrades further improve overlay accuracy and productivity, offering scalability to support next-generation semiconductor manufacturing.

For more information, please visit https://global.canon/en/product/indtech/semicon/fpa6300es6a.html

FPA-5520iV steppers have functions designed for processing of reconstituted FOWLP Wafers that consist of individual die that are mounted and encapsulated onto a carrier substrate for further processing. FOWLP wafers can suffer from severe warpage and die shift that must be overcome.

FPA-5520iV steppers achieve the highest levels of productivity among leading edge i-line steppers.*

FPA-5520iV steppers employ newly developed high-intensity illumination optics system that realizes an approximately 30% improvement in illumination intensity vs. FPA-5510iV steppers. FPA-5520iV steppers reduce exposure times for the thick photo-resist processes to boost back-end wafer processing capacity as much as **20%.

*Among same-class i-line steppers. As of July 4, 2016 (Examination by Canon)

**Throughput compared with the FPA-5510iV. 300 mm wafers, 60 shots, 10000J/m2 dose

In response to the growing demand for high-density redistribution layer wiring in the FOWLP market, "FPA-5520iV HR option" has been released since December 2018. The FPA-5520iV HR Option employs a new projection optical system that achieves a resolution of 0.8µm, the finest resolution available in packaging-oriented lithography systems.

* Among same-class i-line steppers. With flatness equal to Si wafer. As of December 10, 2018. Based on a Canon survey.

The new FPA-5520iV LF2 Option features a fine 0.8µm resolution and 4-shot exposure with minimal distortion to make possible a wide 100×100mm exposure field. This in turn enables mass production of large and dense packaging with fine circuit patterns that integrate 2.5D and 3D technology.

For more information, please visit https://global.canon/en/product/indtech/semicon/fpa5520iv.html

A cluster type PVD equipment supporting thin film deposition of metal wiring material used mainly in semiconductor memory.

Our original CAELA cathode provides excellent uniformity and low particle on reactive sputtering and high stress materials.

These functions enable high yield and productivity to significantly reduce production cost.

Featuring:

• Cathode magnet position (3D) is variable in-situ per each recipe. (enables easy optimization of uniformity and cleaning)
• Provides world’s highest standard throughput (80wfs/H).
• Provides >90% uptime rate at semiconductor memory production line. (failure rate < 1%)

Specifications:

• System configuration: Cluster type
• Substrate size: φ300mm

For more information, please visit https://anelva.canon/en/business/equipment/se_detail02.html

Features

1.Reduced TCO with high throughput, small footprint and minimized conversion time.

2.Easier adjustment, equipped with rework function realizing excellent operability.

3.Minimizes distance between mount and preform, prevents changes over time and reduces wasted movements.

4.Equipped with newly developed twin dispensing system compatible with various pastes.

5.Needleless pickup system (optional) realizes pickups with no damage.

For more information, please visit https://machinery.canon/en/about/products/semiconductor/12inch/bestem-d510/index.html