FPA-5520iV steppers have functions designed for processing of reconstituted FOWLP Wafers that consist of individual die that are mounted and encapsulated onto a carrier substrate for further processing. FOWLP wafers can suffer from severe warpage and die shift that must be overcome.
FPA-5520iV steppers achieve the highest levels of productivity among leading edge i-line steppers.*
FPA-5520iV steppers employ newly developed high-intensity illumination optics system that realizes an approximately 30% improvement in illumination intensity vs. FPA-5510iV steppers. FPA-5520iV steppers reduce exposure times for the thick photo-resist processes to boost back-end wafer processing capacity as much as **20%.
*Among same-class i-line steppers. As of July 4, 2016 (Examination by Canon)
**Throughput compared with the FPA-5510iV. 300 mm wafers, 60 shots, 10000J/m2 dose
In response to the growing demand for high-density redistribution layer wiring in the FOWLP market, "FPA-5520iV HR option" has been released since December 2018. The FPA-5520iV HR Option employs a new projection optical system that achieves a resolution of 0.8µm, the finest resolution available in packaging-oriented lithography systems.
* Among same-class i-line steppers. With flatness equal to Si wafer. As of December 10, 2018. Based on a Canon survey.
The new FPA-5520iV LF2 Option features a fine 0.8µm resolution and 4-shot exposure with minimal distortion to make possible a wide 100×100mm exposure field. This in turn enables mass production of large and dense packaging with fine circuit patterns that integrate 2.5D and 3D technology.
For more information, please visit https://global.canon/en/product/indtech/semicon/fpa5520iv.html