HIGGS BOSON SYSTEMS PRIVATE LIMITED

With our amc-series we will be able to offer individual solutions for substrate coating, developing, lift-off and cleaning. In close cooperation with our customers, we will analyse their individual production and process related needs. Thereupon we will set up their unique amcoss machine with the modules chosen by them on one of our three basis platforms. Any future modifications or conversions can be easily realized at any time. You cannot ask for more flexibility – or performance at an equally attractive price!

Technical details_

Trymax is to support semiconductor manufacturers throughout the world with innovative plasma-based solutions for ashing, descum, surface preparation, isotropic etch, photoresist curing and charge erase that are used in the fabrication of integrated circuits.

Trymax Semiconductor Equipment designs, manufactures, and markets its own NEO equipment. A wide range of different NEO platforms are available, from single chamber semi-automatic tools, through to multi chamber high volume manufacturing platforms. Trymax offers a number of different plasma technology chambers which are configurable across all NEO platforms. This enables Trymax to offer an extremely wide range of different process capabilities to meet customer’s requirements.

The 2 main categories of applications we are addressing are:

• Ashing, descum, light etching, surface preparation and cleaning
• UV photoresist curing and device charge erase

  Features

  100 / 150 / 200mm substrate size configurable
  - 4 integrated SMIF indexer or 4 open cassette stations
  - 4 axis dual arm robot handling with x-track (optional)
  - 2 or 4 process chambers
  - 3 different process chamber technologies available:
        - Microwave downstream (2.45 GHz)
        - RF bias (13.56 MHz)
        - Dual Source (Microwave, RF bias)
  - Mechanical throughput >300wph
  - Compact footprint
  - Very low Cost of Ownership
  - Fully digital controlled, devicenet-ethernet
  - Windows based industrial computers
  - Cooling station and notch aligner
  
   

  Applications

  - Bulk resist, post LDI resist strip
  - Descum processing
  - Polymer removal
  - Post high dose implant strip
  - Silicon nitride/silicon carbide etch applications
  - TaSi etch
  - MEMS applications
  - Advanced packaging processing (PR, PI, BCB, PBO)
  - RF filter BAW/SAW resist processing

IBS PULSION equipment meet < 10 nm requirements

Continued scaling of non-planar HP multigate devices in all aspects:
EOT, junctions, mobility enhancement, new channel materials,
parasitic series resistance, contact silicidation.

• Materials compatibility

• Process integration challenges

• Medium current production implanter for:
• RF and power devices, sensors, opto-electronics manufacturing
• on Si, SiC, GaAs, GaN, LiTaO3, HgCdTe, LiNbO3, InP

Key advantages

-High beam current
-Extended life ion source (>300 hrs)
-Enhanced single or multi-charged Al beam generation
-High resolution analyzer magnet for multi-charged and high AMU beams
-650 °C fast temperature ramp-up/ramp-down platen for SiC
-Optimized throughput for non Si materials

Features