HIGGS BOSON SYSTEMS PRIVATE LIMITED

C2-2694 Sushant Lok-1
Gurugram Gurgaon
Gurgaon,  Haryana  122002

India
https://www.higgsbosonsystems.com/
  • Booth: H1U31

Higgs Boson's journey has grown into a mighty tree with branches spanning the globe. We are proud to be a group of seasoned technocrats with over 20 years of global experience in diverse industries including Automotive, Semiconductor Front End, semiconductor Back End Applications, and Medical.

At Higgs Boson, we are not just a team but a family of energetic and dedicated professionals. Our commitment lies in providing sophisticated, advanced machines, technical solutions, and services that exceed our customers' expectations.

At Higgs Boson, our driving force is relentless growth, constantly pushing the boundaries to reach new heights. We are committed to staying at the forefront of industry technology and equipment, embracing innovation to deliver cutting-edge services to our valued customers. Our ultimate goal is steady advancement, hand in hand with our stakeholders—manufacturers, customers, and employees alike. We firmly believe that an organization ascends to greatness when all its stakeholders consider it their premier partner.


 Products

  • FULLY AUTOMATIC SINGLE-WAFER PROCESSING – AMC
    AMC-series we will be able to offer individual solutions for substrate Photo-resist coating, developing, lift-off and cleaning. Thereupon we will set up their unique amcoss machine with the modules chosen by them on one of our three basis platforms....

  • With our amc-series we will be able to offer individual solutions for substrate coating, developing, lift-off and cleaning. In close cooperation with our customers, we will analyse their individual production and process related needs. Thereupon we will set up their unique amcoss machine with the modules chosen by them on one of our three basis platforms. Any future modifications or conversions can be easily realized at any time. You cannot ask for more flexibility – or performance at an equally attractive price!

    Technical details_

    1. Wafer diameters: 2“ to 8“

    2. Up to 4 I/O stations for 2” to 8” (max. 4 x open cassettes or 2 x SMIF)

    3. Max. 5 individual processing modules

    4. 1 two-link robot handler

    Wet-process modules with multiple options_

    • amc coater module

    • amc developer module

    • amc lift-off module

    • amc cleaning module

    • amc temperature module

    • amc wafer-handling module

    • Optional configurations

  • Trymax NEO series advanced Plasma Equipment
    The NEO series production platform is one of the latest additions to the industry leading NEO range of advanced plasma ashing and etching products from Trymax Semiconductor Equipment. ...

  • Trymax is to support semiconductor manufacturers throughout the world with innovative plasma-based solutions for ashing, descum, surface preparation, isotropic etch, photoresist curing and charge erase that are used in the fabrication of integrated circuits.

    Trymax Semiconductor Equipment designs, manufactures, and markets its own NEO equipment. A wide range of different NEO platforms are available, from single chamber semi-automatic tools, through to multi chamber high volume manufacturing platforms. Trymax offers a number of different plasma technology chambers which are configurable across all NEO platforms. This enables Trymax to offer an extremely wide range of different process capabilities to meet customer’s requirements.

    The 2 main categories of applications we are addressing are:

    • Ashing, descum, light etching, surface preparation and cleaning
    • UV photoresist curing and device charge erase

      Features

      100 / 150 / 200mm substrate size configurable
      - 4 integrated SMIF indexer or 4 open cassette stations
      - 4 axis dual arm robot handling with x-track (optional)
      - 2 or 4 process chambers
      - 3 different process chamber technologies available:
            - Microwave downstream (2.45 GHz)
            - RF bias (13.56 MHz)
            - Dual Source (Microwave, RF bias)
      - Mechanical throughput >300wph
      - Compact footprint
      - Very low Cost of Ownership
      - Fully digital controlled, devicenet-ethernet
      - Windows based industrial computers
      - Cooling station and notch aligner

       

      Applications

      - Bulk resist, post LDI resist strip
      - Descum processing
      - Polymer removal
      - Post high dose implant strip
      - Silicon nitride/silicon carbide etch applications
      - TaSi etch
      - MEMS applications
      - Advanced packaging processing (PR, PI, BCB, PBO)
      - RF filter BAW/SAW resist processing

  • QES - Semiconductor Inspection Equipment
    we have diversified from distributing metrology products into the distribution of scientific-analytical instruments and material business of semiconductor test & assembly....

  • Manufacturing Division

    Looking for a semiconductor equipment manufacturing company that specializes in high-precision motion-controlled equipment? Look no further than our company! We are experts in the assembly and testing of this type of equipment, integrating it with various inspection and measurement sensors for optimal performance.

    Automated Handling Equipment

    We specialize in designing and manufacturing high-quality solutions that can help you optimize your wafer handling processes.

    Our atmospheric robots are designed to handle wafers in a controlled environment, minimizing the risk of contamination and delivering optimal performance. We also offer articulated and SCARA robots for a variety of handling solutions, including loading and unloading wafers from process equipment, transporting wafers between different processing steps, and storing wafers in cassettes or other types of containers.

    Optical Inspection Equipment

    Our expertise in optical-based stereo, macro, and micro inspection, as well as fully automatic 2D and 3D vision systems, enables us to help customers overcome the challenges they face in wafer inspection. Here are some ways in which we can help:

    WIS8000 is designed to handle 8” wafer and 12” wafer sizes. The standard design comes with two standard load ports which can accommodate the 12” SEMI Standard FOUP, 12” SEMI Standard FOSB and 8” SEMI Standard Open Cassette. It can be upgraded to three load ports. During the wafer handling, the system is using the robotic arm to transfer the wafer to/from pre-aligner or inspection chuck. Besides, WIS8000 comes with a wafer gripper with the tilting capability for front and back wafer inspection (macro inspection) and high power microscope with 5 objectives for the micro inspection.

    Specifications
    • Designed for 200mm and 300mm Wafer
    • Comes with 2 x Hirata FOUP Ports that can accommodate FOUP/ FOSB, need Hirata Adapter for 8” Open Cassette
    • R-Theta Wafer Handling System
    • Hirata Wafer Pre-Aligner (8 & 12” wafers)
    • Programmable Motorized Stage with Vacuum Chuck
    • Wafer Mapping System
    • Anti-Vibration Isolation Platform
    • IOSS WID120 OCR Reader
    • TCP-IP & RS232 Data Interfaces
  • ION IMPLANTATION SYSTEM
    Plasma immersion ion implantation is a versatile process technology with wide applications in microelectronics processing & materials engineering. ...

  • IBS PULSION equipment meet < 10 nm requirements

    Continued scaling of non-planar HP multigate devices in all aspects:
    EOT, junctions, mobility enhancement, new channel materials,
    parasitic series resistance, contact silicidation.

    • Materials compatibility

    • Process integration challenges

    • Medium current production implanter for:
    • RF and power devices, sensors, opto-electronics manufacturing
    • on Si, SiC, GaAs, GaN, LiTaO3, HgCdTe, LiNbO3, InP

    Key advantages

    -High beam current
    -Extended life ion source (>300 hrs)
    -Enhanced single or multi-charged Al beam generation
    -High resolution analyzer magnet for multi-charged and high AMU beams
    -650 °C fast temperature ramp-up/ramp-down platen for SiC
    -Optimized throughput for non Si materials

    Features

    -Quad implant, autotune up to 10 chained implantations
    -From coupons to 200 mm, parallel scanning for 200 mm wafers
    -Up to 1.2 MeV
    -High efficiency ion sources (Indirect heated Cathode, ECR)
    -Up to 8 different implant gases

  • LOW-PRESSURE PLASMA SYSTEMS
    Low-Pressure Plasma Systems: Operate at pressures significantly lower than atmospheric pressure. Used for precise surface treatments, etching, cleaning, and coating applications....

  • Low-Pressure Plasma Systems: Operate at pressures significantly lower than atmospheric pressure. Used for precise surface treatments, etching, cleaning, and coating applications.

    Technical Data

    VACUUM CHAMBER 
     1    Stainless steel round:                                        Ø 267 mm, D 420 mm
     2    Stainless steel rectangular, hinged door:   W 240 mm x H 240 mm x D 420 
     3    Aluminium rectangular, hinged door:          W 240 mm x H 240 mm x D 420 mm (max. 3 m) 
     4    Silica glass (UHP):                                                  Ø 240 mm, D 400 mm
     5    Borosilicate glass (HP):                                      Ø 240 mm, D 400 mm

    CHAMBER VOLUME:                                           Approx. 18 - 24 litres
    GAS SUPPLY:                                                            mass flow controllers (MFCs)
    PRESSURE MEASUREMENT :                            Pirani, Capacity pressure gauge
    VACUUM PUMP:                                                   Capacity: min. 16 m3 /h
    ELECTRODES:                                                        According to customer requirements 

    GENERATOR FREQUENCY: 
      1   100 kHz / 0 - 500 W; 80 kHz / 0 - 1000 W- 13.56 MHz / 0 
      2    300 W; 2.45 GHz / 0 - 600 W

    CONTROLS: 
      1   Semiautomatic Basic 
      2   PC control (Windows CE)
      3   Full PC control (Windows 10 IoT)

    POWER SUPPLY 
      1   230 V / 50 - 60 Hz for tabletop unit 
      2   400 V / 50 - 60 Hz, 3 phases for stand-alone unit

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