MDX3D INDIA LLP

Fourth Floor, Module No. B4-03, Block B, Phase II, IIT Madras Research Park, Kanagam Road, Taramani
Chennai,  Tamil Nadu  600113

India
https://www.moldex3d.com/
  • Booth: H3O36


Welcome to Moldex3D! Visit us at booth H3O36.

Moldex3D is the world leading CAE product for the plastic injection molding industry. With the best-in-class analysis technology, Moldex3D can help you carry out in-depth simulation of the widest range of injection molding processes and to optimize product designs and manufacturability. In addition, its high compatibility and adaptability have provided users with instant connection to mainstream CAD systems, generating a flexible simulation-driven design platform.


 Press Releases

  • Hsinchu, Taiwan — March 13, 2024 — With the pursuit of low-carbon and circular economy as the future development goals, the plastic industry is entering a new era of competition. Compared to traditional metal materials, plastics are more adaptable to industry demands, including lightweight design, energy conservation, environmental protection, low manufacturing costs, design flexibility, and performance standards. Moldex3D 2024 emerges in response to these needs, committed to providing advanced simulation solutions to easily handle various complex processes. With the support of the Moldiverse cloud platform services, optimization of production processes begins at the design stage, making it an essential tool for innovation and efficiency.

    The important updates and highlights of Moldex3D 2024 are as follows:

    Continuous Improvement of Molding Efficiency to Achieve Energy-Saving and Carbon Reduction Goals

    Proper utilization of CAE software allows for the identification of potential design problems and optimal solutions during new product design, achieving advantages in low manufacturing costs, design flexibility, lightweight design, and improved safety. Moldex3D 2024 Compression Molding can accurately simulate the mold temperature changes during the mold movement process, achieving more accurate compression molding results.

    The Moldex3D Resin Transfer Molding Module facilitates evaluation and selection of suitable production conditions through filling and curing analysis. It provides intelligent wizard tools and post-processors, supports complete RTM model preprocessing, and facilitates early defect diagnosis and design modifications. Additionally, Moldex3D introduces model comparison, multi-group comparison report functions, and result display lists to optimize result output, save file storage space, and provide a superior user experience.

    Addressing Challenges in Electronic Encapsulation Processes to Improve IC Packaging Quality and Performance

    In the era of strong development in AI intelligence, IC packaging is heading towards two directions of high reliability and high performance, each with different design and manufacturing requirements. To meet strict product standards, the use of molding analysis can quickly solve production defects and accelerate time-to-market.

    Moldex3D 2024 continues to enhance IC packaging simulation capabilities. In addition to basic flow filling and curing process simulations, the newly added wire bonding further expands the application scope. It not only helps improve product quality and effectively prevents potential defects but also optimizes designs through simulation to reduce manufacturing costs and cycle time.

    Furthermore, we also launched the industry’s first electronic potting simulation. Using convenient modeling tools and setting interfaces, a variety of process designs can be replicated, providing users with more realistic and detailed visualization of dispensing head paths and feeding. Leveraging complete physical models to simulate surface tension-induced phenomena achieves more comprehensive electronic encapsulation simulation.

    Facilitating Plastic Component Design to Enhance Quality and Efficiency

    With technological advancements and evolving demands, plastic products have found more innovative applications. In addition to meeting comfort and aesthetic requirements, they must also possess functionality and safety. Moldex3D 2024 enhances the simulation accuracy and speed of large components, assisting users in efficiently obtaining optimal production parameters when designing products such as bumpers, thereby improving quality and increasing production output. The addition of the Dual Nakamura model enables more realistic simulation of warpage, and exporting warpage deformation results as STEP models allows users to consider the degree of warpage for mold compensation adjustments, effectively eliminating the impact of product deformation.

    Moldex3D 2024 also continues to enhance insight into the appearance of plastic components, optimizing welding line calculation efficiency, and supporting bilinear isotropic hardening models. We strengthen shrinkage prediction capabilities in injection molding and foam molding, considering the effect of trapped air, thus enabling various defects to be addressed at the design stage, reducing the significant time and cost of mold reworking.

    Comprehensive Support for Plastic Molding Cloud Services, Leading The New Trend of Digital Transformation

    Moldex3D 2024 continues to improve its various support services in plastic molding. The Moldex3D iSLM data management platform introduces Personal Mode for individual use and Server Mode for cross-team collaboration, providing more flexible usage modes. It also enhances IC-related data organization, optimizes model comparison functions, supports more CAD file types, and provides carbon footprint calculation functions to assist users in meeting the strictest carbon emission standards.

    Moldex3D 2024 also brings more innovative services through the Moldiverse cloud platform, including the MHC Material Cloud, iMolding Hub, and University. With these services, users can quickly evaluate and select various plastic materials, acquire and establish in-house machine databases, and access the latest plastic industry information and selected seminars anytime, anywhere. With highly flexible and convenient services, product performance can be verified at the design stage, expanding the support scope of Moldex3D.

    For more information about the new features of Moldex3D 2024, please visit: https://www.moldex3d.com/products/moldex3d-2024


 Products

  • Moldex3D
    The leading true-3D molding simulation software...

  • The leading true-3D molding simulation software can be applied in a wide range of plastic molding processes. We can predict potential manufacturing defects, validates part/mold design, lowers mold development costs, evaluates manufacturability, shortens time-to-market, and greatly increases business value.

    - One single platform to run all powerful Moldex3D simulations
    - Integrated workflow to ensure accurate meshing and modeling
    - Support multiple processes by applications. Check out our solution

     

    >>Check What's new in Moldex3D 2024!

  • IC Packaging
    Significant molding problems can be predicted and solved upfront, which helps engineers enhance chip quality and prevent potential defects more efficiently....

  • Moldex3D IC Packaging helps chip designers to fully analyze the chip encapsulation process from filling, curing, cooling, to advanced manufacturing demands, such as wire sweep, die shift, filler concentration, underfill encapsulation, post-molding curing, stress distribution, or structural evaluation. Significant molding problems can be predicted and solved upfront, which helps engineers enhance chip quality and prevent potential defects more efficiently. The accurate simulation also helps design optimization and well cost management.

    >>Check More!

  • Electronics Potting
    Unleash Reliability with Electronics Potting Precision...

  • Leverage Moldex3D Electronics Potting simulation to optimize electronic potting processes and enhance outcomes. Predict air trap locations, assess temperature variations, chemical reactions, and more for precise evaluation of product shape and stress distribution.
     

    >>Check More!

  • iSLM
    Whole New Management Platform for Plastic Injection...

  • iSLM is an intelligent and interactive data management platform designed for plastic engineering companies. The items of data management include model feature size, gate size, gate type, cooling system design, mold tryout parameters, CAE simulation results etc. Users can simply centralize the important and valuable data in the iSLM platform throughout the entire product development lifecycle.

    >>Check More!

  • Moldiverse
    The cloud ecosystem offering polymer material data, smart molding solution, learning contents and more...

  • Moldex3D integrates simulation and manufacturing to build the cloud ecosystem that helps you establish, preserve and manage the knowledge assets to carry out digital transformation.

    >>Check More!

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