Nano Span Technologies, LLC

State-of-the-art wafer inspection tool that is revolutionary in the semiconductor equipment marketplace in that it’s the first system to perform full-wafer 2-D and 3-D analysis at high throughput. It detects and reports the presence of wafer defects, scratches, particles, residue, and edge damage with location, count, and size information. The patented technology enables particle detection from sub-micron sizes (100nm) to large (millimeters) process signatures with a single scan; and allows for wafer defect determination down to sub-nanometer levels.

Features:

Utilizes a proprietary infrared detection scheme, coupled with the powerful Clarity software platform, to quickly characterize bonded wafers for voids, cracks, and delamination, as well as crystal defects in various types of substrates including, GaN, SiC, and diamond. Detects and locates defects and anomalies down to below 1 micron, and the user-focused, easy-to-use software interface quickly classifies them for further process assessment and optimization.

Features:

Surface analysis and defect review tool that has the combined capabilities of a scanning electron microscope (SEM) and an atomic force microscope (AFM) in one tool.  ~1 angstrom z-height detection capability to quickly characterize any surface in 3D in a matter of minutes using Photometric Stereo Technology (PST). User-focused software interface is the easiest to use of any system in the marketplace.