Visit us to discover innovative semiconductor test solutions
Smiths Interconnect is a leading provider of innovative solutions for critical semiconductor test applications. Smiths Interconnect’s test socketsand probe card solutions offer superior quality and reliability, providing customers with a competitive advantage.
Our best-in-class engineering and technical expertise ensure the development of cutting-edge test platforms for area array, peripheral, wafer level and Package on Package (PoP) devices.
Our extensive product portfolio accommodates both devices with finest micro pitches and those with very high bandwidth requirements. Off-the-shelf
and custom products are proven to deliver the best solution for the customer’s specific needs.
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