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Sumitomo Bakelite Singapore Pte. Ltd.

1 Senoko South Road
Woodlands
Singapore,  758069

Singapore
https://www.sumibe.co.jp
  • Booth: H6B36


Pioneer in plastics

Expanding the potential of plastics to become
"a company that makes your dreams for the future a reality"

 Products

  • SUMIKON® EME - Epoxy Resin Molding Compounds
    Epoxy Resin Molding Compounds for Encapsulation of Semiconductor Devices ...

    • Sumitomo Bakelite Co., Ltd. is serving the IC encapsulating material market as the top supplier in the world. Since 1971, with our continuous efforts towards technological innovations, we have played the leading role in the industry. Our integrated manufacturing system composed of 4 plants in 4 countries and regions (i.e. Kyushu, Singapore, China, Taiwan) facilitates smoother delivery of our products to clients throughout the world. We provide a wide variety of encapsulating materials to satisfy various requirements for semiconductor packages.

    Plants
    Kyushu Sumitomo Bakelite Co., Ltd.
    Sumitomo Bakelite Singapore Pte. Ltd.
    Sumitomo Bakelite (Suzhou) Co., Ltd.
    Sumitomo Bakelite (Taiwan) Co., Ltd.

    Laboratory
    Information & Telecommunication materials research Laboratory (Japan)
    Information & Telecommunication materials research Laboratory (Taiwan)
    Information & Telecommunication materials research Laboratory (China)
    Information & Telecommunication materials research Laboratory (Singapore)

    Video :

    Video Contents of IT materials (sumibe.co.jp)

  • SUMIRESIN EXCEL®CRM
    Pastes for Die Bonding...

    • In the domestic market of die attach pastes, Sumitomo Bakelite Co., Ltd. has kept the leading position with the highest market share while also actively developing overseas markets.
    From 3 manufacturing bases, in Japan (Utsunomiya city), China and Singapore, we can provide high level and high quality products with an on-time delivery system.
    Sumitomo Bakelite Co., Ltd. supplies not only conventional packaging materials but also materials proactively developed for BGAs, CSPs, LED and other advanced packages.

    Plants

    • Utsunomiya Plant
    • Sumitomo Bakelite (Suzhou) Co., Ltd.
    • Sumitomo Bakelite Singapore Pte. Ltd.

    Laboratory

    • Information & Telecommunication materials research Laboratory (Japan)
    • Information & Telecommunication materials research Laboratory (China)
    • Information & Telecommunication materials research Laboratory (Singapore)

    Video :

    Video Contents of IT materials (sumibe.co.jp)

  • Dicing tape/UV Releaseable Tape (SUMILITE® FSL)
    UV tape for dicing process in semiconductor and related field...

    • UV tape for dicing process in semiconductor and related field. UV dicing tape which Sumitomo Bakelite has developed is designed to meet variety of customers' requirements by balancing out the 3 elements of "Cohesion", "Adhesion" and "Tack strength". It is UV curing type which can perfectly hold silicon wafer, resin substrate and other kinds of adherend.

    Plant

    • Amagasaki Plant

    Laboratory

    • Film & Sheets Research Laboratory

Categories

300 Packaging and Assembly Materials
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Molding; Encapsulation; Potting; Resin Materials

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