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Global Marketing Services

#1, Sharadanagar, Uttarahalli Main Road
Vasanthapura
Bangalore,  Karnataka  560061

India
https://www.gms-india.com
  • Booth: H8F19


One Stop Solution for all semiconductor manufacturing needs.

Global Marketing Services [GMS] is a leading solution provider for your semiconductor process engineering and product development requirements. GMS was founded in 2001 and started its operations in Bangalore. We offer a one-stop shop and comprehensive R&D solution, from ideation and concept development to prototyping. The IITs, ISRO, DRDO, DAE, CSIR and numerous significant public and private organizations like Bharat Electronics [BEL), etc. are just a few of the labs and institutes where our solutions and equipment have been utilized. We have been successful for the past 20 years and these accomplishments driven by excellence were made possible by the robust connections we have with our clients and partners around the world.


 Products

  • Die Bonder T-5100
    The T-5100 is an universal workhorse for a wide range of micro-assembly tasks. The manual operation makes it so very flexible and adaptable to many tasks in the R&D area, and it is just as popular for small-scale and pilot production....

  • T-5100

    PC controlled Manual Die Bonder

    The T-5100 is the successor of the proven and well known T-3000-M series with many features of the PRO-series. It is an universal workhorse for a wide range of micro-assembly tasks. The manual operation makes it so very flexible and adaptable to many tasks in the R&D area, and it is just as popular for small-scale and pilot production.

    The extremely rigid machine, with its completely redeveloped base is compact and fits on a lab desk. It can be expanded with many different modules to cover an enormous range of applications.

    Operating a Tresky die bonder/placer is intuitive. A few minutes’ training is sufficient to start working
    with the machine. The accuracy and repeatability of placing parts is superb thanks to a number of wellthought
    out features like a true, linear Z-Axis, Force Control, XY Fine Control and high-resolution optics that allow flip-chip placing down to sub-micron accuracy.

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