D&X Co., Ltd.

D&X Japan provides high-quality silicon wafers ranging from 1 inch to 12 inches, available in Prime, Test, and Monitor grades. We offer bare wafers, SOI wafers, and compound wafers including GaAs and SiC. Surface finishes include Single Side Polished (SSP) and Double Side Polished (DSP), with strict particle control down to 15 nm.

Our wafers are widely used in IC, MEMS, LED, power devices, and R&D applications. We maintain ready stock for standard specifications and support flexible customization based on customer requirements. All wafers are delivered with Certificate of Analysis (COA) and meet international quality standards.

With fast lead times and a commitment to quality, D&X Japan supports your innovation with stable supply and responsive service.

D&X Japan provides a complete lineup of back grinding, dicing, and bumped tapes for advanced wafer processing applications. Our tapes are engineered for strong adhesion during processing and clean, stable release after UV or thermal treatment.

• Back grinding tapes protect the wafer surface during thinning.

• Dicing tapes secure wafers during singulation, ensuring precision and yield.

• Bumped tapes are designed for wafers with bumps or uneven surfaces, offering reliable coverage and stress control.

Available in UV and non-UV types, our tapes support a wide range of wafer sizes and materials including Si, SiC, GaAs, glass, and compound wafers. We also offer customized options for thickness, peel strength, and release characteristics.

Trusted by OSAT customers in IC packaging, MEMS, LED, and power device production, D&X tapes are manufactured in-house under strict quality control, ensuring high reliability and fast delivery.