OKAMOTO INDIA PRIVATE LIMITED

GNX200BH – High-Rigidity Wafer Grinder

The GNX200BH is a high-precision, fully automatic wafer backgrinder designed for 200 mm wafers. Built with a high-rigidity structure, it ensures stable grinding performance across a wide range of materials including Si, SiC, GaN, AlTiC, LT, and LN.

Key Functions:

• Down-feed grinding method for consistent thickness control

• Integrated high-pressure dresser (HPD) to minimize wheel clogging on soft or sticky materials

• In-process thickness gauge for real-time wafer monitoring

• Robotic wafer handling with cassette-to-cassette automation

• Compatible with BG tape grinding and high-bump wafer processing

Ideal for advanced packaging, power semiconductors, and thin wafer applications.

The VG401 is a compact, semi-automatic grinder for small-lot and R&D wafer or PLP processing, designed for manual or low-volume production environments.

Key Features:

• Supports single or batch processing with a max 400mm chuck.

• Vertical spindle down-feed grinding for precise control

• Ideal for Si, sapphire, glass, and compound semiconductors

• User-friendly touchscreen interface for easy operation

• High-rigidity structure ensures excellent flatness and repeatability

• Optional in-process thickness gauge and chuck table options available

Perfect for development labs, pilot lines, and niche applications requiring flexibility and precision.

Automatic Wafer polisher for 300mm wafers.