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POLYMATECH ELECTRONICS LIMITED

Plot No OZ 13 , SIPCOT HI TECH SEZ ,
ORAGADAM ,
KANCHEEPURAM District,  Tamil Nadu  602105

India
https://www.polymatech.in
  • Booth: 1014

 Press Releases

  • Polymatech Electronics Limited Announces Completion of PCB Manufacturing Facility in Europe

    August 11, 2025 — Polymatech Electronics Limited is thrilled to announce the successful commissioning of its state-of-the-art Printed Circuit Board (PCB) manufacturing facility in Estonia, Europe. This milestone represents a significant advancement in the company’s strategic expansion across the European market.

    The new facility features around 10,000-square-foot cleanroom equipped with cutting-edge machinery, capable of producing up to 50,000 square meters of multi-layer High-Density Interconnect (HDI) PCBs annually. Leveraging advanced European technology, the facility meets the stringent industry standards demanded by premium mobile phone manufacturers and critical sectors, including defense, aerospace, automotive electronics, semiconductor manufacturing, telecommunications infrastructure, industrial electronics, and security.

    “Our European-made PCBs, crafted with European expertise and adhering to the highest quality standards, are in high demand across various high-end applications,” said Mr. Eswara Rao Nandam, CEO Polymatech Electronics Limited. “This facility underscores our commitment to innovation, quality, and precision, positioning us to deliver tailored, engineered solutions to some of the most demanding industries.” This development marks a pivotal step in transforming Polymatech into a comprehensive solutions provider, evolving from a component supplier into a product-centric organization.

    The Estonia facility underscores Polymatech’s evolution from a component supplier to a product-centric solutions provider. “Since incorporating the Company on November 18, 2024, and commencing operations on August 8, 2025, this facility exemplifies our dedication to quality, reliability, and customer-centric innovation,” said Tarja Rapala, Director of Polymatech Electronics and Head of PCB Business. “With meticulously maintained equipment and a highly skilled team, we are poised to deliver rapid, sustainable PCB solutions and foster strategic partnerships across Europe.”

    Dr. Allen Nejah, Chief Innovation Officer of Polymatech Electronics Limited, added, “This facility is a remarkable achievement that enhances our ability to deliver sophisticated PCB solutions for Europe’s technological and defense sectors. PCB is the mother for electronic equipment and this facility enables Polymatech transformation from component manufacturer to product manufacturer, this will be a paradigm shift in the Polymatech’s business profile and help us to release products faster in the market. This facility portfolio includes high-speed PCBs, advanced HDI PCBs, high-frequency PCBs, and multi-layer configurations—up to 48 layers—designed for high-end electronics.

    Mr. Urmas Aruoja, CEO, stated, “We deliver PCBs in as little as 24 hours. Our flexible PCBs are integral to smartphones, notebooks, smart wearable devices, and many other products. Our Substrate-Like PCBs (SLPs), HDI PCBs, Rigid-Flex PCBs (RPCBs), Integrated Circuit Substrates (ICS), RF PCBs, and high-density modules are designed for advanced applications. Our HDI PCBs feature high-density attributes, including laser microvias, sequential lamination structures, fine lines, and high-performance thin materials, enabling greater functionality per unit area. Advanced HDI PCBs incorporate multiple layers of copper-filled stacked microvias, providing complex interconnections for large pin-count, fine-pitch, and high-speed chips in cutting-edge technology products.”

    For further information about Polymatech Electronics Limited and its new European facility, please contact:

    About Polymatech Electronics Limited

    Polymatech Electronics Limited is a global leader in advanced electronics manufacturing, specializing in semiconductor solutions—from ingots to end products. Committed to innovation, the company delivers transformative technologies every six months, enhancing everyday life by integrating cutting-edge solutions across consumer and industrial applications. Polymatech is a key player in the global technology market, holding significant market share in semiconductors, modules, and electronic components for industries including retail, finance, agriculture, and healthcare. With a vision to become a comprehensive end-to-end solutions provider, Polymatech continues to drive excellence and innovation worldwide.

  • Polymatech


    Polymatech Honored with Best Manufacturer Award at Hospex 2025


    Chennai, India – August 31, 2025 – Polymatech, a global leader in semiconductor
    and electronics innovation, proudly participated in Hospex 2025, India’s foremost
    international exhibition on healthcare technology, hospital infrastructure, and
    medical electronics, held in 22nd – 24th August 2025 at Kochin. This premier platform
    showcased groundbreaking advancements in medical devices, diagnostics, and
    supportive electronics, bringing together industry pioneers and innovators to
    advance healthcare delivery. Polymatech’s state-of-the-art manufacturing
    facilities, specializing in medical and horticulture chips, stood out for their ecofriendly,
    AI-optimized components designed to minimize energy consumption
    while ensuring unparalleled reliability in critical healthcare applications, including
    diagnostic equipment, wearable health monitors, and horticulture lighting for
    pharmaceutical agriculture.
    Polymatech is thrilled to announce that it has been awarded the prestigious Best
    Manufacturer Award in the electronics and semiconductor category at Hospex
    2025. This accolade recognizes Polymatech’s cutting-edge technology, which
    seamlessly integrates advanced semiconductor solutions into life-enhancing
    medical and healthcare applications. With end-to-end control over its value
    chain—from sapphire ingot fabrication to chip assembly—Polymatech ensures
    superior performance, strict adherence to ISO standards, and compliance with
    applicable government regulations, including FDA approvals. This capability
    enables rapid customization to meet the evolving needs of the healthcare
    industry, positioning Polymatech as a trusted partner in delivering innovative
    solutions.
    The Best Manufacturer Award underscores Polymatech’s leadership in India’s
    rapidly growing $372 billion healthcare market (projected for 2025) and paves the
    way for new strategic partnerships with hospitals, medtech companies, and global
    exporters. This recognition not only enhances Polymatech’s brand visibility but
    also drives revenue growth by deepening its penetration into the global medtech
    industry. Committed to its mission of integrating technology into life-saving
    applications, Polymatech plans to launch new medical products every six months,
    further solidifying its role as an innovator in healthcare technology.
    “We are deeply honored to receive the Best Manufacturer Award at Hospex 2025,”
    said Eswara Rao Nandam, MD & CEO at Polymatech. “This recognition validates
    our relentless pursuit of excellence in developing sustainable, high-performance
    semiconductor solutions that empower the healthcare industry. We are excited to
    continue driving innovation and delivering transformative technologies that
    enhance lives worldwide.”
    For more information about Polymatech’s award-winning solutions or to explore
    partnership opportunities, please visit www.polymatech.sg or contact
    [email protected]
    About Polymatech: Polymatech is a global leader in the design and manufacture
    of advanced semiconductor and electronic components for the healthcare and
    horticulture industries. With a focus on sustainability, AI optimization, and
    precision manufacturing, Polymatech delivers innovative solutions that power
    critical applications in medical diagnostics, wearable health monitors, and
    pharmaceutical agriculture. Headquartered in Greater Chennai, India, Polymatech
    is committed to integrating technology into life-saving applications, driving
    progress in the global healthcare ecosystem.

  • Polymatech Announces Expansion of Land Allotment and SEZ Proposal in
    Chhattisgarh


    Raipur, Chhattisgarh — September 1, 2025 – Polymatech Electronics, a global
    frontrunner in semiconductor and electronic component manufacturing, is thrilled
    to announce a significant milestone in its Raipur initiative. The company has
    secured an additional 25 acres in Atal Nagar, Nava Raipur, bringing its total land
    holdings to 35 acres. This strategic acquisition advances Polymatech’s vision of
    creating a state-of-the-art electronics and semiconductor manufacturing hub in
    India.
    Polymatech SEZ: A Catalyst for Innovation
    In light of recent reforms by the Government of India, which have reduced the
    minimum land requirement for Special Economic Zones (SEZs) dedicated to
    semiconductor or electronics manufacturing to 10 hectares (approximately 24.7
    acres), Polymatech intends to apply for SEZ status under the SEZ Act, 2005. This
    designation, once approved, will unlock a suite of incentives—including customs
    duty exemptions, income-tax holidays for export-oriented units, and streamlined
    regulatory processes—enabling cost efficiencies and reinvestment in R&D and
    advanced manufacturing.
    The proposed Polymatech SEZ will act as a unified innovation ecosystem
    encompassing the company’s semiconductor fabrication, sapphire wafer
    production, PCB assembly, semiconductor testing equipment, and specialist hightech
    applications spanning telecom, defense, aerospace, and automotive sectors.
    Powering India’s Electronics Momentum
    This SEZ aligns seamlessly with India’s ambition under initiatives such as Make in
    India and the India Semiconductor Mission to emerge as a global electronics
    manufacturing powerhouse. India’s electronics production is projected to reach
    US $300 billion by 2026.
    The SEZ’s infrastructure will include reliable power supply, advanced logistics, and
    cutting-edge R&D labs—enabling scale-up of high-frequency Gallium Nitride (GaN)
    chips vital for 5G and 6G applications, reinforcing Polymatech’s leadership in nextgeneration
    telecommunications.
    Regional Economic and Social Impact
    Polymatech’s SEZ promises to drive substantial economic growth in Chhattisgarh
    by generating hundreds of high-skilled jobs and attracting talent, partners, and
    investment. It is poised to elevate Nava Raipur as a national hub for advanced
    electronics and semiconductor manufacturing.
    Construction of the state-of-the-art facility in Atal Nagar remains on schedule,
    with the company’s resilience and operational excellence ensuring readiness amid
    seasonal challenges.
    "Our vision for this SEZ is to build a world-class hub for electronics and
    semiconductor innovation that not only elevates India’s global competitiveness
    but also stimulates sustainable growth in Chhattisgarh," said Eswara Rao Nandam,
    Managing Director & CEO, Polymatech Electronics. "This expansion and SEZ
    proposal affirm our commitment to technological self-reliance and delivering
    pioneering solutions globally."
    About Polymatech Electronics
    Polymatech Electronics is a global leader in designing and manufacturing
    advanced semiconductors and electronic components, tailored for healthcare and
    horticulture industries. With a focus on sustainability, AI-driven optimization, and
    precision manufacturing, the company delivers innovative solutions powering
    medical diagnostics, wearable health monitoring, and pharma-agricultural
    applications. Based in Greater Chennai, India, Polymatech continues to integrate
    technology for life-enhancing applications across the global healthcare landscape.
    For more information, please visit www.polymatech.sg

 Products

  • Sapphire Ingots
    Polymatech produces sapphire ingots with high hardness, clarity, and stability. Available as long, polished, or cut types, they power semiconductors, LEDs, and optical applications with precision...

    • Polymatech manufactures high-quality sapphire ingots, which are the base material for advanced semiconductor, LED, and optical applications. With excellent hardness, thermal stability, and optical clarity, our sapphire ingots are trusted for precision and performance. We offer three main types of ingots to meet diverse industry needs. Long Sapphire Ingots These are the original crystal-grown cylindrical ingots with uniform structure and high purity. Long ingots serve as the starting material for cutting, polishing, and wafering. They provide excellent transparency and durability, making them ideal for LEDs, semiconductors, and optical applications. Polished Sapphire Ingots Polished ingots are processed with high-precision polishing to achieve a smooth, defect-free surface. This ensures better dimensional accuracy and readiness for wafer slicing. Polished sapphire ingots are widely used in semiconductor devices, high-power LEDs, and optical components where surface quality is critical. Cut Sapphire Ingots Cut ingots are customized into required sizes and shapes as per customer specifications. They are processed with care to maintain crystal quality and maximize wafer yield. These ingots are commonly used for wafer manufacturing, optical windows, and specialized substrate applications. At Polymatech, our sapphire ingots combine strength, stability, and precision to deliver consistent performance. Whether for LEDs, semiconductors, or optics, we provide solutions tailored to the evolving demands of advanced technology

  • Sapphire Wafers
    Polymatech produces high-purity sapphire wafers that serve as essential substrates for semiconductor, optoelectronic, and advanced optical applications....

    • Sapphire Wafers

    Polymatech produces high-purity sapphire wafers that serve as essential substrates for semiconductor, optoelectronic, and advanced optical applications. Known for their excellent hardness, chemical resistance, and thermal stability, our wafers provide a reliable foundation for next-generation devices. We offer sapphire wafers in different surface finishes to meet diverse industry requirements.

    Unpolished Sapphire Wafers

    These are basic wafers sliced from sapphire ingots without additional finishing. They retain natural surface texture and are suitable for further processing steps like polishing or etching. Unpolished wafers are mainly used for R&D, testing, and applications where surface smoothness is not critical.

    One-Side Polished Sapphire Wafers

    These wafers are polished on one surface to provide a smooth, defect-free finish while keeping the other side unpolished. This makes them cost-effective and versatile, especially for LED substrates, optical coatings, and semiconductor processing. The polished surface ensures better layer adhesion and performance consistency.

    Two-Side Polished Sapphire Wafers

    Both sides of the wafer are precision polished for maximum smoothness, flatness, and optical clarity. These wafers are used in high-end applications where surface quality on both sides is crucial, such as advanced LEDs, high-frequency devices, optical components, and laser applications.

    At Polymatech, our sapphire wafers are designed to deliver consistency, durability, and precision. Whether for LEDs, lasers, semiconductors, or optical solutions, we provide wafers engineered to support the evolving needs of advanced technology.

  • LED Packages - COB & HTCC
    Polymatech offers advanced LED packaging solutions that enhance reliability, performance, and efficiency across lighting, medical, and industrial applications. ...

    • Polymatech offers advanced LED packaging solutions that enhance reliability, performance, and efficiency across lighting, medical, and industrial applications. Our packaging technologies ensure better heat dissipation, long lifespan, and high light quality. Two of our key LED package types are Chip-on-Board (COB) and High-Temperature Co-Fired Ceramic (HTCC).
    COB (Chip-on-Board) LED Packages
    In COB packaging, multiple LED chips are mounted directly onto a single substrate, creating a compact light-emitting module. This design reduces thermal resistance, improves light uniformity, and delivers higher lumen output. COB LEDs are widely used in applications such as general illumination, automotive lighting, horticulture lighting, and medical devices, where high brightness and efficiency are essential.
    HTCC (High-Temperature Co-Fired Ceramic) LED Packages
    HTCC packaging uses multilayer ceramic substrates co-fired at high temperatures, providing excellent thermal conductivity, mechanical strength, and reliability. HTCC LED packages are ideal for high-power and high-temperature applications where durability and performance stability are critical. They are commonly used in medical lighting, defense technologies, aerospace, UV applications, and precision electronics.
    At Polymatech, we combine material expertise with advanced packaging technology to deliver LEDs that perform consistently in demanding environments. Our COB and HTCC packages ensure not only high efficiency and brightness but also long-term reliability, enabling innovative lighting solutions across industries.
  • PCB Substrates
    ​Polymatech provides high-quality PCB (Printed Circuit Board) substrates that form the foundation for reliable LED packaging and advanced electronic assemblies. ...

    • Polymatech provides high-quality PCB (Printed Circuit Board) substrates that form the foundation for reliable LED packaging and advanced electronic assemblies. Built for excellent thermal management, electrical efficiency, and mechanical stability, our substrates support high-power, long-life, and high-performance applications across industries. We offer multiple substrate solutions tailored to different technology needs.
    Single-Sided PCB Substrates
    These feature copper circuitry on only one side of the board. They are simple, cost-effective, and widely used in LED drivers, consumer electronics, and entry-level lighting applications where performance requirements are moderate.
    Double-Sided PCB Substrates
    With copper layers on both sides, these substrates enable more complex designs and higher component density. They are ideal for industrial lighting, automotive electronics, and power supplies requiring greater functionality and reliability.
    Multi-Layer PCB Substrates
    Consisting of multiple copper and dielectric layers connected with vias, these substrates support advanced circuit designs. They enable compact, high-performance solutions for LED modules, medical equipment, telecommunications, aerospace, and precision electronics.
    Metal-Core PCB (MCPCB) Substrates
    Built with a metal base, typically aluminum, MCPCBs provide superior heat dissipation. They are essential for high-power LEDs, automotive headlamps, street lighting, and industrial luminaires where thermal management is critical.
    At Polymatech, we combine engineering precision with material expertise to deliver PCB substrates that ensure consistency, durability, and efficiency. Whether for basic circuits or advanced electronic systems, our solutions are designed to meet the demanding requirements of modern semiconductor and lighting technologies.
  • Polymatech Products
    Polymatech offers Nisene decapsulation machines with both Plasma Etch and Laser Etch technologies, enabling advanced semiconductor analysis and failure detection....

    • Polymatech offers Nisene decapsulation machines with both Plasma Etch and Laser Etch technologies, enabling advanced semiconductor analysis and failure detection. These machines are engineered for precision, safety, and efficiency in removing encapsulation material from integrated circuits (ICs) without damaging internal structures.

    Plasma Etch Technology

    Plasma etching uses reactive plasma to gradually remove organic packaging materials. This non-contact, non-destructive method delivers a clean surface with minimal stress, making it ideal for fragile devices and thin die. Plasma etch is preferred when chemical exposure must be minimized.

    • Excellent control and uniform removal
    • Safe for delicate or high-value samples
    • Ideal for failure analysis, counterfeit detection, and R&D

    Laser Etch Technology

    Laser etching employs a controlled laser beam to ablate encapsulant material with high precision. It provides fast processing, repeatability, and adaptability for various IC packages while preserving die and bond wire integrity.

    • High precision with rapid throughput
    • Programmable for multiple package types
    • Effective for detailed inspections in high-volume labs

    Applications
    Both Plasma and Laser Etch Nisene machines are widely used for:

    • Semiconductor failure analysis
    • Reliability and quality testing
    • Counterfeit IC identification
    • Research and device development

    At Polymatech, we integrate Nisene’s Plasma and Laser Etch systems to deliver safe, accurate, and consistent decapsulation solutions. These machines support our commitment to innovation, reliability, and world-class semiconductor quality.

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