Lapmaster Wolters India Private Limited

Corp. Office : 1st Floor, Plot No. 55, 2nd Street, Samayapuram Main Road
Karambakkam, Porur
Chennai,  Tamil Nadu  600116

India
https://www.lapmaster-wolters.co.in

• Booth: 384

Witness Precision Wafer Solutions:Lapmaster Wolters, H1-B384

Lapmaster Wolters is a trusted global partner for the semiconductor wafer manufacturing sector, delivering customized high-precision surface processing solutions for wafers and substrates. We serve industries utilizing silicon, silicon carbide, sapphire, gallium arsenide, and other advanced materials to produce micro-electronic, micro-optical, and micromechanical devices.

Since 1953, our multi-wire saws have set the technological benchmark for slicing Si, SiC, and other hard, brittle materials into the highest-quality wafers, achieving exceptional material utilization and cost savings. With the delivery of our first silicon wafer lapping machine in 1961, Lapmaster Wolters has built decades of expertise in semiconductor processing.

Today, our double-side lapping and polishing machines for wafers up to 300 mm define the state-of-the-art in local and global geometry control, while our latest single-wafer processing systems further expand our portfolio for the semiconductor industry.

Lapmaster Wolters’ machine tools continue to set new standards in precision, quality, efficiency, and total cost of ownership—not just for today’s requirements, but for the challenges of tomorrow.

 Press Releases

• Lapmaster Wolters 12" Silicon Wafer Polisher AC2000P4+ (20250816)

  The next generation of Precision Wafering Technology : for Industry looking... 300mm Silicon Prime Wafering. Come to our stall # 384 and get experince...The new AC2000P4+ represents a significant leap forward for the silicon prime-wafering industry. Multi-dimensional production targets and ever increasing market requirements demand both – highest possible quality, while ensuring cost-effective and efficient manufacturing. 

  
  The AC2000P4+ is designed to fulfill all flat finishing production targets on one and the same tool. The market leading batch processing approach enables users to polish fifteen 300 mm (12") silicon wafers in parallel, while realizing unmatched CpK-performance on best-in-class surface finishing level. The combination of high throughput and market-leading quality results generates a unique synergy and offers highest possible flexibility.

• Lapmaster Wolters Multi-Wiresaw DW288S4, Dedicated to Semiconductor SiC Wafer (20250816)

  The DW288S4, with its new features specifically designed for slicing SiC or other Semiconductor materials, offers the best solution for our customers. Its thin wire handling capability, combined with highly precise tensioning control, reduces slicing kerf loss while maintaining unbeatable low wire breakage rates.

  The proven and reliable wire winding system ensures fault-free winding of hundreds of kilometers of ultra-thin wire, resulting in longer load lengths and reduced downtime for wire spool changes. Excellent temperature stability of the machine and accurate process control capabilities enhance the quality of each wafer. 

  
  Our leading-edge slicing equipment provides versatile solutions and processes to lower the overall cost of ownership for wafer manufacturers. With higher process automation and the integration of MES and AI, overall manufacturing productivity can be significantly increased.