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Toho Koki Seisakusho Co., Ltd.

38 Kogane-cho
Yokkaichi-city,  Mie  512-8062

Japan
http://tohokoki.jp/toppage-en/
  • Booth: 936A


Proven technology supporting semiconductor manufacturing!

We have developed and commercialized numerous advanced technologies in collaboration with universities and research institutes both in Japan and overseas.

Leveraging this knowledge, when a major Japanese company entered the semiconductor industry, we provided technical guidance in addition to introducing equipment, which contributed greatly to the company's growth.

Our facilities and technology will be a great help as India advances its domestic semiconductor production.

Let's join forces to help the Indian semiconductor industry take off!


 Products

  • CMP pad groove processing machine CMP1100S
    The CMP pad processing machine is equipped with a variety of processing tools and a 4-axis NC device, enabling a single machine to perform all types of processing necessary for CMP pads....

  • Abrasive resin plates called CMP pads are used to polish (Chemical Mechanical Polishing) semiconductor wafers. CMP is an important process that accounts for approximately 30% of the cost of device manufacturing. Toho Koki Seisakusho is a leader in the field of CMP pad processing machines(China‘s share is 100%) and has earned accolades from customers in Japan and abroad for 25 years. 
  • AlN template on sapphire substrate
    Realizing high efficiency and low cost deep UV LEDs AlN template on sapphire substrate....

  • Demand for deep-UV LEDs is increasing due to the sterilizing effect of deep UV light and its use as an alternative to mercury lamps.

    Achieving high efficiency and low cost have become major challenges for deep-UV LEDs. We overcame these challenges through joint research on sputtering and the annealing method with Mie University (Professor Miyake) and have realized the World's highest quality, high-efficiency, low-cost AlN template on a sapphire substrate.

  • CARE-TEC
    The CARE-TEC achieves planarization using water, without using the slurry used in CMP. It is a clean technology that significantly reduces the environmental impact. ...

  • The catalyst-referred etching (CARE) method, which was devised by Osaka University (Professor Yamauchi and Sano), is the world's first technology to enable planarization of substrates at the atomic level, where no affected layers (latent scratches) are formed.

    It is drawing attention as a revolutionary slurry-free key process for next-generation semiconductor production.

  • Bonding SiC substrate
    In cooperation with related companies, we can provide high-quality, low-cost bonded SiC substrates using bonding technology that can solve this problem....

  • Previously, to manufacture high-quality SiC substrates, it was necessary to produce SiC with good crystallinity, which entailed high costs due to technical issues.

    By using bonding technology to bond high-quality SiC substrates to low-cost SiC substrates, we can manufacture SiC substrates that are both high quality and low cost.


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