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Maxell Asia, Ltd

UNIT NOS. 03B-06, 13/F, 909 CHEUNG SHA WAN ROAD, CHEUNG SHA WAN, KOWLOON
Hong Kong, 
Hong Kong
https://maxell.com.hk/
  • Booth: 486

The Future is Within

At Maxell, we love to make people smile.
Synergizing our unique analog technology with the latest digital, and connecting with people through our products we have excited and impressed so many in countless ways.

And by further leveraging our powers, we aim to be closer within the future of people through their daily living, cars, health, beauty and more by delivering surprises beyond their dreams.

So expect more from the new Maxell.
We’ll provide greater wonders to your every day with bold approaches that create synergy across our fields.

Because within us,
lie the power to transform the future,
bringing more freedom to enrich the lives of everyone.

 Press Releases

  • Maxell proudly introduces its latest lineup of high-performance adhesive tapes designed specifically for semiconductor wafer and package dicing, as well as back grinding protection. The SLIONTEC series—comprising the No.636000 Dicing Tape for wafers, No.636015 Dicing Tape for packages, and No.635249 Back Grinding Tape—offers cutting-edge solutions to enhance precision, yield, and environmental safety in semiconductor manufacturing processes.

    No.636000 Dicing Tape (for Wafer)
    This tape features a higher isotropic olefin backing combined with a UV peeling adhesive, optimized for various wafer dicing applications. It delivers strong adhesion (2.80 N/10mm) and excellent holding power under heat (40℃), ensuring wafers remain securely fixed during processing. The environmentally sensitive adhesive contains no solvents and is free from toluene/xylene, supporting cleaner manufacturing environments. The tape’s design allows full usage to the end, reducing material waste and rejects.

    No.636015 Dicing Tape (for Package)
    Tailored for package dicing, this tape shares the same advanced backing and UV peeling adhesive technology as the wafer tape. It provides consistent adhesion and holding power, facilitating reliable fixation of packages during dicing. Its solvent-free, eco-friendly adhesive composition enhances safety and sustainability in production lines. The tape’s standard type classification makes it a versatile choice for diverse package dicing needs.


    Designed to protect bumped wafers during back grinding, this tape prevents dimples and wafer damage with its high conformity to bumps approximately 300μm in diameter. Available in UV and non-UV types, the non-UV version features an initial adhesion of 0.25 N/10mm, ensuring secure wafer protection without compromising surface integrity. Like the dicing tapes, it employs an environmentally sensitive adhesive free from harmful solvents.

    Common Benefits Across the SLIONTEC Series

    • Environmentally sensitive adhesives with no solvents, toluene, or xylene

    • High adhesion and holding power for secure fixation

    • Full tape utilization to minimize waste and rejects

    • Clear application guidelines to ensure optimal performance

    • Designed to meet demanding semiconductor manufacturing standards

    Maxell’s SLIONTEC tapes represent a significant advancement in adhesive technology for the semiconductor industry, combining performance, environmental responsibility, and cost-efficiency. These products support manufacturers in achieving higher yields and improved product quality while adhering to stricter environmental regulations.

    For more information on Maxell’s SLIONTEC tape series and technical support, please visit Maxell’s official website.

    https://biz.maxell.com/en/sliontec_tapes/

 Products

  • No.636000 Dicing tape (for Wafer)
    Dicing tapes (for wafer) consist of higher isotropic olefin backing and UV peeling adhesive Applications and Features -For various wafer dicing -Standard type...

    • The product No.636000 Dicing Tape (for Wafer) from Maxell is designed specifically for wafer dicing applications. Here are the key details:

    • Made of higher isotropic olefin backing combined with a UV peeling adhesive.

    • Suitable for various wafer dicing processes.

    • Classified as a standard type tape.

    Test Item Unit Value
    Adhesion N/10mm 2.80
    Tack Ball No. 6
    Holding Power Creep mm/24h 0.1
    Adhesion to UV N/10mm 0.23

    • Holding power tested at 40℃ with 9.8N force.

    • Test methods follow the Sliontec standard.

    • The tape can be used fully to the end, helping to reduce rejects.

    • Uses an environmentally sensitive adhesive that contains no solvents and is free from toluene/xylene.

    • Clean the surface from dirt, dust, oils before applying.

    • Apply sufficient pressure for good adhesion.

    • Store in a cool, dark place away from direct sunlight and heat.

    • Not suitable for electrical insulation.

    • Avoid applying directly on furniture, walls, glass, PVC, or car bodies to prevent residue or damage.

    • Not intended for skin contact unless specifically designed for it.

    • Confirm tape selection carefully to avoid residue or contamination.

    • Consult the manufacturer for special applications.

    • Specifications may change without notice.

    • Use with caution; the manufacturer is not liable for damage caused by improper use.

    This tape is optimized for wafer dicing with reliable adhesion and environmentally friendly composition.

  • No.636015 Dicing tape (for Package)
    Dicing tapes (for package) consit of higher isotropic olefin backing and UV peeling adhesive. Applications and Features - Suitable for various package dicing processes. - Classified as a standard type tape....

    • The product No.636015 Dicing Tape (for Package) from Maxell is designed for use in various package dicing applications. Here are the key details:

    • Made of higher isotropic olefin backing combined with a UV peeling adhesive.

    • Suitable for various package dicing processes.

    • Classified as a standard type tape.

    Test Item Unit Value
    Adhesion N/10mm 2.80
    Tack Ball No. 6
    Holding Power Creep mm/24h 0.1
    Adhesion to UV N/10mm 0.23

    • Holding power tested at 40℃ with 9.8N force.

    • Test methods follow the Sliontec standard.

    • The tape can be used fully to the end, helping to reduce rejects.

    • Uses an environmentally sensitive adhesive that contains no solvents and is free from toluene/xylene.

    • Clean the surface from dirt, dust, oils before applying.

    • Apply sufficient pressure for good adhesion.

    • Store in a cool, dark place away from direct sunlight and heat.

    • Not suitable for electrical insulation.

    • Avoid applying directly on furniture, walls, glass, PVC, or car bodies to prevent residue or damage.

    • Not intended for skin contact unless specifically designed for it.

    • Confirm tape selection carefully to avoid residue or contamination.

    • Consult the manufacturer for special applications.

    • Specifications may change without notice.

    • Use with caution; the manufacturer is not liable for damage caused by improper use.

    This tape is optimized for package dicing with reliable adhesion and environmentally friendly composition.

  • No.635249 Back grinding tape
    Maxell’s BG tape prevents from Dimples and wafer damage with its high conformity to　bumped wafers of a large diameter. We have two types, UV and non-UV. Applications and Features - High bump surface conformity - Non-UV type...

    • The product No.635249 Back Grinding Tape from Maxell is designed to protect bumped wafers of large diameter during back grinding, preventing dimples and wafer damage.

    • : Prevents dimples and damage on bumped wafers during back grinding.

    • : Available in two types — UV and non-UV (the product described is the non-UV type).

    •  to accommodate bumps approximately 300μm in diameter.

    Test Item Unit Value
    Adhesion (Initial) N/10mm 0.25

    • Peeling strength test conditions:

      • Adherend: SUS304

      • Peeling angle: 180°

      • Peeling speed: 300 mm/min

    • Tape can be used fully to the end, reducing rejects.

    • Uses an environmentally sensitive adhesive compound with no solvents and free from toluene/xylene.

    • Clean the surface from dirt, dust, oils before applying.

    • Apply sufficient pressure after applying the tape to ensure adhesion.

    • Store in a cool, dark place away from direct sunlight and heat sources.

    • Not suitable for electrical insulation purposes.

    • Avoid applying on furniture, walls, glass, PVC, car bodies to prevent residue or damage.

    • Not intended for direct skin contact unless specifically designed.

    • Confirm tape selection carefully to avoid residue or contamination.

    • Consult Maxell for special applications.

    • Specifications may change without prior notice.

    • Use with caution; Maxell is not liable for damage from improper use.

    This tape is optimized for protecting wafers with bumps during back grinding processes, ensuring high conformity and minimal damage risk.

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