Modern manufacturing demands precision, reliability, and eco-friendly processes. Whether it is semiconductor packaging, electronics assembly, automotive components, or flexible packaging films, the ability to achieve clean, activated, and bondable surfaces is critical. Traditional methods such as flame treatment, chemical primers, or solvent-based cleaning are increasingly viewed as unsafe, inconsistent, and environmentally harmful.
Eltech Engineers Pvt. Ltd., with over three decades of expertise in plasma and surface treatment technologies, has developed the Atmospheric Plasma Surface Treatment System to meet these challenges. Our system combines advanced plasma science with user-friendly engineering, offering manufacturers a sustainable, high-performance solution for surface modification.
How It Works
Atmospheric plasma is generated by applying high voltage across a specially designed electrode in the presence of ambient or controlled gases. The resulting plasma jet contains a mixture of:
- Electrons & ions – which break down surface contaminants.
- Radicals & excited species – that chemically modify the surface.
- UV radiation – that further aids in cleaning and surface activation.
When directed onto a substrate, this plasma jet removes organic residues, increases surface energy, and introduces functional groups that significantly improve adhesion for inks, coatings, adhesives, or encapsulants.
Key Features
- High-Speed Treatment – Capable of operating at line speeds exceeding 120 m/min, ideal for roll-to-roll and high-volume production.
- Non-Contact & Damage-Free – Plasma jet interacts gently with substrates, suitable for sensitive materials such as thin films, electronics, and wafers.
- Versatile Substrate Compatibility – Works effectively on polymers (PE, PP, PET, PTFE), metals, glass, ceramics, and semiconductor materials.
- Eco-Friendly – Eliminates the need for primers, chemical etchants, or solvent-based cleaning agents.
- Precision Control – Adjustable plasma intensity, nozzle size, and treatment width for customized results.
- Integration Ready – Can be mounted on conveyors, robotic arms, or inline production systems.
- Consistent Results – Provides uniform activation across large surfaces and complex geometries.
Technical Advantages
- Surface Energy Increase: Raises substrate wettability from <30 dynes/cm to >70 dynes/cm.
- Adhesion Enhancement: Improves bonding strength of adhesives, coatings, and laminates by up to 300%.
- No Heat Damage: Plasma jet temperature remains safe, ensuring no warping or melting of sensitive substrates.
- Scalable Designs: Available in single-nozzle units for R&D or multi-head configurations for industrial lines.
- Low Operating Costs: Uses only compressed air or nitrogen as process gases, with minimal power consumption.
Applications
1. Semiconductors & Electronics
- Wafer cleaning and micro-activation prior to metallization.
- Improved adhesion of photoresists, encapsulants, and conformal coatings.
- Bonding of protective films and passivation layers.
- Enhanced printability and solder mask adhesion on PCBs.
2. Packaging & Printing
- Surface activation of films (PE, BOPP, PET, etc.) for ink adhesion.
- Improved lamination strength in multilayer films.
- Replacement for corona treatment in specialized applications.
3. Automotive & Aerospace
- Adhesion promotion for paints, adhesives, and coatings.
- Treatment of lightweight composites and engineered plastics.
4. Medical & Healthcare Devices
- Surface activation of bio-compatible plastics.
- Improved bonding of coatings on catheters, syringes, and diagnostic devices.
5. General Industry
- Glass and ceramic treatment for coatings.
- Adhesive bonding in consumer electronics and appliances.
Benefits to Manufacturers
- Eco-Sustainability – Eliminates VOCs, solvents, and chemical waste.
- Higher Productivity – Inline compatibility reduces manual steps and increases throughput.
- Cost Savings – No recurring chemical purchase, storage, or disposal costs.
- Improved Quality – Stronger adhesion leads to fewer product failures and customer complaints.
- Regulatory Compliance – Meets increasingly strict environmental and safety standards.
Why Choose Eltech?
- Proven Expertise: 33+ years in plasma, corona, and ozone technologies.
- Customization: Systems tailored to customer substrates, line speeds, and process requirements.
- Make in India Advantage: Locally manufactured, ensuring cost competitiveness and faster service.
- Global Standards: Designed to meet international benchmarks for reliability and safety.
- Complete Ecosystem: Integration with Eltech’s corona treaters, ozone generators, and static eliminators for end-to-end solutions.
System Configurations
- Single Nozzle System – Compact, ideal for R&D labs, prototyping, and small-batch runs.
- Multi-Nozzle Inline System – Designed for high-speed production, covering wider substrates.
- Robotic Plasma Jet System – Flexible treatment of 3D components, PCBs, or molded parts.
- Custom Solutions – Built-to-spec for unique substrates or semiconductor fab requirements.
Future-Ready Technology
Eltech continues to invest in R&D for plasma innovations, focusing on:
- Hybrid plasma systems combining corona + plasma for enhanced treatment.
- Intelligent control with PLC + HMI and IoT monitoring for predictive maintenance.
- Energy-efficient plasma jets reducing power consumption further.