Handotai India Pvt Ltd

<p>We provide made-to-order as well as off-the-shelf wafers from the world's leading wafer manufacturers in the following categories:</p><ol><li>Compound Semiconductors (GaN, SiC, GaAs, InP, and other III-V Wafer materials)</li><li>Glass Wafers and Fused Silica Wafers (custom coatings available)</li><li>Sapphire Wafers</li><li>Silicon on Sapphire (SOS) Wafers</li><li>Silicon on Insulator (SOI) Wafers</li><li>Silicon Wafers (Bare Wafers/Oxide and Nirtride Coated Wafers/Epitaxial Wafers)</li></ol><figure class="media"><oembed url="https://indiahandotai.com/product-category/device-fab/wafers/" /></figure>... More Info Less Info

<p><span style="color:rgb(0,0,0);">Our UV tape for dicing process in semiconductor and related fields is designed to meet customer requirements by balancing out the 3 elements of “Cohesion”, “Adhesion” and “Tack”. It's designed to have a bubble free adhesion and can hold various materials like wafers, resin substrates and other kind of materials.</span></p><p><span style="color:rgb(0,0,0);">It can be customized as per client requirements for thickness, adhesion and structure.</span></p><p><span style="color:rgb(0,0,0);">Highly suitable for advanced packaging applications as well as convention dicing applications. They come in various configurations as below.</span></p><ol><li>Standard UV Release Tape</li><li>Double sided UV Release tape</li><li>Low Energy UV Release Tape</li><li>Anti-static UV Release Tape</li></ol><figure class="media"><oembed url="https://indiahandotai.com/product-category/osat-atmp/adhesive-semiconductor-tapes/" /></figure>... More Info Less Info

<p>High flatness and great elongation for wafer back grinding / thinning protection, substrate cutting. </p><p>For uneven surface masking protection.</p><p>Acidic and Alkaline resistance: pH3~10</p><p>Clean lift off without residue</p><p>Thermal release tapes with release temperatures varying 80°C - 190°C</p><p>For wafer dicing, back grinding chip dicing, sputtering process, MLCC dicing, LED dicing, substrate cutting, lens cutting, nameplate cutting or any semiconductor Industry production process.</p><figure class="media"><oembed url="https://indiahandotai.com/products/wafer-back-grinding-tape/" /></figure>... More Info Less Info

<p>High temperature tape with specialized adhesive for high temperature capability up to 260C.</p><p>Especially used in QFN moulding process to prevent epoxy bleeding.</p><p>Consistently stable at high temperature.</p><figure class="media"><oembed url="https://indiahandotai.com/products/qfn-packaging-tape/" /></figure>... More Info Less Info

<div style="background-color:rgb(255,255,255);color:rgb(55,53,53);font-family:'Golos Text', sans-serif;font-size:14px;font-style:normal;font-weight:400;letter-spacing:normal;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;word-spacing:0px;"><p style="margin-bottom:0px;padding-left:20px;"><strong>Material: </strong>Stainless Steel, ABS (Plastic), PPS (Plastic)</p><p style="margin-bottom:0px;padding-left:20px;"><strong>Applications:</strong> Suitable for semiconductor industry, LED, wafer, electronics industry, clean room</p><p style="margin-bottom:0px;padding-left:20px;"><strong>Surface: </strong>Polished and Matte Surface, both options available</p><p style="margin-bottom:0px;padding-left:20px;"><strong>Sizes:</strong> 6-inch, 8-inch, 12-inch</p><p style="margin-bottom:0px;padding-left:20px;"><strong>Shapes: </strong>Square Rings, Customized shapes and sizes as per client spec.</p><p style="margin-bottom:0px;padding-left:20px;"><strong>Engraving Options:</strong> Serial No., Part Number, QR, Bar Code, Laser engraved identification</p><p style="margin-bottom:0px;padding-left:20px;"><strong>Thickness:</strong> 1.2mm - 2.65mm</p><p style="margin-bottom:0px;padding-left:20px;"></p><p style="margin-bottom:0px;padding-left:20px;">Today, our wafer frames are trusted and used by international semiconductor companies including Amkor, ASE, SanDisk, TSMC, KLA, ABB, Sony, etc.</p></div>... More Info Less Info

<h3>The new generation OnTrak system is here, directly from the OEM</h3><p>The modernized Entrepix DSS-200 double-sided post-CMP wafer cleaner offers the same familiar functionality as the legacy OnTrak system with numerous upgrades for today’s cleaning process demands.</p><p>As the OEM for OnTrak systems, Entrepix has engineered the NEW DSS-200 OnTrak for reliability and longevity with support and spares you can depend on.</p><h4>Our DSS-200 cleaners offer:</h4><ul><li>Parts exchangeable with legacy OnTrak sysems.</li><li>Replacement and modernization of obsolete parts.</li><li>Configuration for 100-200mm substrates/wafers.</li><li>Accommodation for smaller wafers with custom-designed carriers.</li></ul>... More Info Less Info