EDGETECH SCIENTIFIC PRIVATE LIMITED

UNIT 302 E BLOCK LSC DDA MARKET VIKAS PURI
Delhi,  West Delhi  110018

India
https://edgetech.in/
  • Booth: H6216

Driving Cutting-edge solutions for Semiconductor Industry.

Edgetech Scientific Pvt. Ltd. is a premier sales, marketing, and distribution company in India, with over 20 years of experience providing advanced equipment and materials for the semiconductor and photovoltaic industries. We offer a comprehensive portfolio of front-end and back-end semiconductor equipment, materials, metrology, characterization, probing and testing solutions, supporting semiconductor manufacturing, advanced packaging, photovoltaic production, and other high-technology applications. Our Technology Portfolio • Lithography Solutions – Photolithography, Nanoimprint Lithography (NIL), E-beam Lithography & Steppers • Coater & Developer Systems • Wet Processing Systems • Oxidation, Diffusion & LPCVD Furnaces • Molecular Beam Epitaxy (MBE) Systems • Metrology & Characterization Tools for Semiconductor & Photovoltaic Applications • Probing & Testing Solutions • Nanopositioning & Nanomanipulation Solutions • Crystal Growth Pullers for Semiconductor & Photovoltaic Applications • Advanced Packaging & Back-End Solutions – Wire Bonders, Die Bonders, Pick-and-Place Tools & Dispensing Nozzles • Semiconductor & Photovoltaic Materials & Consumables Meet Us at SEMICON India 2026 Visit Edgetech Scientific Pvt. Ltd. at SEMICON India 2026, where we will showcase our advanced technology solutions alongside our valued global partners: Semilab Zrt. | Micro Point Pro | Thermco Systems | Riber | PVA Crystal Growing Systems GmbH | Imina Technologies | Shellback Discover how our global technology partners and local expertise can support your semiconductor, photovoltaic, advanced packaging, and high-technology manufacturing projects. OVER 20 YEARS OF EXPERIENCE | ADVANCED EQUIPMENT & MATERIALS | GLOBAL TECHNOLOGY | LOCAL EXPERTISE

Categories

200 Packaging and Assembly Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Dispensing Systems
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
  • Wire Bonding Equipment
    • 203 Inspection & Measurement Products
  • CV (capacitance-to-voltage) Probe systems
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • Die Inspection; Die Shear
  • Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
  • Instruments; Bench Top Test
  • Line Width; Critical Dimension (CD) Measurement
  • Microscopes: Atomic Force Microscopes (AFM)
  • Overlay Measurement
  • Resistivity Measurement; 4 point probe; Sheet resistance
  • Spectrometers; FTIR; ATR-FTIR; Auger Electron (AES); SIMS
  • Stress; Refractive Index; Reflectivity & Conductivity Measurement
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
  • Wire Bonding Inspection; Test
    • 204 MEMS Equipment
  • Deep RIE etching; Dry Etching
  • Double sided mask aligner
    • 205 Nanotechnology Equipment and Tools
  • Equipment, Nanotechnology Tools
    • 207 Process Equipment
  • Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
  • Coat; Develop; Resist Processing; Track Equipment
  • Crystal Growing & Machining Equipment
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Epitaxy Equipment; Epi Reactors; Molecular Beam Epitaxy (MBE); Atomic Layer Epitaxy (ALE)
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Ion Implantation Equipment
  • Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
  • Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment
    • 208 Test Equipment
  • Burn-In Systems
  • Package Test Systems
  • Probe Card Maintenance and Analysis Systems
  • Probing Equipment incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers
    • 300 Packaging and Assembly Materials
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
  • Molding; Encapsulation; Potting; Resin Materials
    • 309 Test Materials
  • Burn-In Boards; Performance Boards (incl. Low; High Temp and Ceramic)
  • Probe Cards; DUT boards and other probing accessories (incl Ceramic and Special Purpose Probe Cards)

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