HIGGS BOSON SYSTEMS PRIVATE LIMITED

C2-2694 Sushant Lok-1
Gurugram Gurgaon
Gurgaon,  Haryana  122002

India
https://www.higgsbosonsystems.com/
  • Booth: H7516

Innovate with Higgs Boson at Semicon India

Discover advanced semiconductor solutions from Hesse Mechatronics, Trymax, and Amcoss GmbH.

Hesse (Germany), a global leader in automated wire bonders and ultrasonic welders, showcases the Bondjet series for thin and heavy wire bonding, the Smart Welder SW1085 for precise ultrasonic welding, and Laser Welders LW1089/2095 for power electronics, battery modules, and e-mobility applications.

Trymax (Netherlands) delivers plasma-based equipment for ashing, descum, resist removal, and surface cleaning, offering flexible platforms from R&D to high-volume production for logic, memory, MEMS, power, and packaging.

Amcoss (Austria) provides wafer processing and photolithography solutions including photoresist coaters/developers, thermal processing tools, and refurbishment services for cost-efficient, long-life semiconductor production.

Together, they enable innovation across the semiconductor, automotive, and power electronics industries.

Categories

200 Packaging and Assembly Equipment
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Ball Placement; Attach Systems
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Device Handling; Feeding Systems
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Dispensing Systems
  • Lead Finishing; Straightening Equipment
  • Lead Frame Taping Systems
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
  • Marking; Imprinting; Labeling Equipment
  • Molding; Encapsulation; Decapsulation Equipment
  • Solder Reflow; Soldering & Brazing Equipment
  • Tape Automated Bonding (TAB); Bumped Tape Automated Bonding (BTAB) Equipment
  • Wafer Level Bonders
  • Wafer Mount; Taping Equipment
  • Wire Bonding Equipment
    • 201 Flat Panel Display Equipment
  • Scribe and Break Equipment
    • 203 Inspection & Measurement Products
  • Die Inspection; Die Shear
  • Package Inspection; Lead Scanners
  • Stress; Refractive Index; Reflectivity & Conductivity Measurement
  • Wire Bonding Inspection; Test
    • 204 MEMS Equipment
  • Deep RIE etching; Dry Etching
  • Wafer Level Bonders
    • 207 Process Equipment
  • Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment
  • Coat; Develop; Resist Processing; Track Equipment
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
  • Epitaxy Equipment; Epi Reactors; Molecular Beam Epitaxy (MBE); Atomic Layer Epitaxy (ALE)
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Ion Implantation Equipment
  • Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
  • Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment
    • 208 Test Equipment
  • Optical Test Systems
  • Package Test Systems
    • 300 Packaging and Assembly Materials
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
    • 700 Manufacturing Services
  • Deposition Service
  • Etch; Strip; Cleaning Service
  • Ion Implant Service
  • Lithography; Patterning service
  • Measurement; Inspection Service

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