AGC Asia Pacific (India) Pvt. Ltd.

Suite No.2, 2nd floor, Vatika First India Place Block-B, Sushant Lok-1, MG Road
Gurgaon,  Haryana  122002

India
https://www.agc.com/en/index.html?utm_source=Tradeshow&utm_medium=release&utm_campaign=SemiconINDIA2025
  • Booth: 133

Welcome to AGC Asia Pacific! View our solutions for SEMICON!

Overview

AGC will exhibit Glass Carrier used for advanced packaging of Semiconductors, Through Glass Vias, Glass Substrate as well as Film, and Resin products used in semiconductor manufacturing processes and equipment.

Categories

101 Photovoltaic Device Manufacturing
  • PV: Modules
  • PV-Building-Integrated Solutions
    • 200 Packaging and Assembly Equipment
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
  • Wire Bonding Equipment
    • 206 PV Equipment
  • Modules
  • Thin Film
    • 207 Process Equipment
  • Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment
    • 300 Packaging and Assembly Materials
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
  • Package Substrates; Laminate; Film based
  • Packages; Ceramic and Other High Temp Compounds
    • 301 Chemicals & Solids
  • Acids; Etchants
  • Cleaning Chemicals; Solvents; Strippers
  • Other Specialty Chemicals
    • 307 Process Materials
  • CMP; Grind; Lap; Polish; Abrasive materials
  • Quartzware (Silicon Carbide, Fused Quartz Glass, Sapphire), Ceramic & Oxide Ceramic Fixtures
    • 400 Components, Parts & Accessories
  • Gaskets; Seals; O rings; Elastomers; Resins
  • Sensors

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