Handotai India Pvt Ltd

1st Floor, Plot No. 20/1
DLF Industrial Area Phase 2
Faridabad,  Haryana  121003

India
https://www.indiahandotai.com
  • Booth: H4618

India Handotai is a deep-tech materials science company with 2 divisions. The first division is dedicated to developing various materials for the semiconductor industry. The goal of this company is to offset the geo-political risk of semiconductor manufacturing by indigenizing the materials supply chain. The second division is a distribution organization which represents various Asian, European and American companies in India for their raw materials, consumables and machinery in the semiconductor industry.

Categories

200 Packaging and Assembly Equipment
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Molding; Encapsulation; Decapsulation Equipment
  • Wafer Level Bonders
  • Wafer Mount; Taping Equipment
  • Wire Bonding Equipment
    • 201 Flat Panel Display Equipment
  • Scribe and Break Equipment
    • 203 Inspection & Measurement Products
  • Die Inspection; Die Shear
  • Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
  • Particle Monitors; Analyzers - Airborne or Liquid
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
  • Wire Bonding Inspection; Test
    • 206 PV Equipment
  • Inspection and Metrology
    • 207 Process Equipment
  • Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
  • Transfer Systems for Wafer; Reticles or FPD's
    • 208 Test Equipment
  • Package Test Systems
  • Probing Equipment incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers
    • 300 Packaging and Assembly Materials
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
  • Lead Frames & Headers: Etched; Stamped
  • Molding; Encapsulation; Potting; Resin Materials
  • Package Substrates; Laminate; Film based
  • Packages; Ceramic and Other High Temp Compounds
  • Scribe Tools; Saw or Dicing Blades and Accessories
  • Thermal Interface Materials; Heat Sinks
    • 301 Chemicals & Solids
  • Acids; Etchants
  • Cleaning Chemicals; Solvents; Strippers
  • Other Specialty Chemicals
  • Photo Resist; Developers & Ancillaries (incl. Adhesion promoter (HMDS); Primer; Anti-Reflective Coat
    • 306 PV Materials
  • Consumables
    • 307 Process Materials
  • CMP; Grind; Lap; Polish; Abrasive materials
  • Deposition Supplies
  • Deposition/Target Materials
    • 308 Substrates
  • Compound Semiconductor substrates (GaAs on Silicon; GaN; InP; SiGe, etc.)
  • Epitaxial; Epi; Gettered; Internal Gettered Wafers
  • Gallium Arsenide (GaAs); Sapphire Substrates
  • Prime; Polished; Mirrored Wafers
  • Silicon on Insulator (SOI); Silicon on Sapphire (SOS); Silicon Carbide;
  • Strained silicon; Engineered Substrates
  • Test; Monitor Wafers; Reclaim or Virgin
  • Thin & Thick film substrates for MEMS
    • 309 Test Materials
  • Burn-In Boards; Performance Boards (incl. Low; High Temp and Ceramic)
  • Probe Cards; DUT boards and other probing accessories (incl Ceramic and Special Purpose Probe Cards)
  • Test Sockets; Contactors and Contact accessories
    • 700 Manufacturing Services
  • Sawing; Lapping; Grinding; Polishing Service
    • 804 Professional Services
  • Sales; Manufacturers Representation or Distributors

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