HIGGS BOSON SYSTEMS PRIVATE LIMITED

C2-2694 Sushant Lok-1
Gurugram Gurgaon
Gurgaon,  Haryana  122002

India
https://www.higgsbosonsystems.com/
  • Booth: H7516


Innovate with Higgs Boson at Semicon India

At **SEMICON India 2026**, Higgs Boson Systems Pvt. Ltd. proudly represents six globally renowned technology leaders, delivering advanced semiconductor manufacturing, packaging, process engineering, and reliability solutions to support India's rapidly growing semiconductor ecosystem. **UniTemp GmbH (Germany)** specializes in precision semiconductor packaging and thermal processing technologies, including wedge and ball bonding systems, rapid thermal processing (RTP), annealing, flux-less reflow soldering, alloying processes, and advanced die bonding solutions for R&D and production environments. **Notion Systems GmbH (Germany)** is a pioneer in high-precision industrial inkjet printing systems for semiconductor manufacturing, wafer-level packaging, microelectronics, MEMS, and advanced functional material deposition, enabling maskless digital printing with exceptional accuracy. **Trymax Semiconductor Equipment B.V. (Netherlands)** develops plasma-based semiconductor process equipment for photoresist stripping, plasma ashing, descum, surface activation, and wafer cleaning, helping manufacturers achieve superior process performance and yield. **Powatec** provides innovative wafer preparation and semiconductor assembly equipment, including wafer mounters, wafer expanders, UV flash curing systems, and back grinding tape laminators, ensuring reliable wafer handling and high-yield manufacturing. **Cambridge Vacuum Engineering (United Kingdom)* is a global leader in Electron Beam Welding technology, delivering high-precision vacuum welding systems for semiconductor, aerospace, medical, automotive, and high-value manufacturing applications requiring exceptional joint quality. Hesse Mechatronics (Germany) is internationally recognised for advanced wire bonding technologies, offering fine wire, heavy wire, wedge, ball, and ribbon bonding systems for semiconductor packaging, power electronics, automotive modules, and microelectronics manufacturing.

 Products

  • Rapid Thermal Processing (RTP) System – UniTemp GmbH
    <p>The Rapid Thermal Processing (RTP) System from UniTemp GmbH is designed for high-precision thermal processing in semiconductor research, development, and production environments. The system delivers rapid heating and cooling with excellent temperature uniformity, enabling highly controlled processes such as annealing, dopant activation, oxidation, alloying, and thin-film processing. Advanced process control minimises</p><figure class="image image-style-align-center image_resized" style="width:25.53%;"><img src="/user_content/review_items/photos/temp/1099bd6de0a7e83447875540d71b1de0-huge-en_fb3161d20672_rtp-100-hvlopen.jpg" alt="1099bd6de0a7e83447875540d71b1de0-huge-en_fb3161d20672_rtp-100-hvlopen.jpg" /></figure><p> thermal stress while improving wafer quality and process repeatability. Suitable for silicon, compound semiconductor, MEMS, and advanced packaging applications, the RTP system supports research institutes, universities, pilot production lines, and semiconductor manufacturers. Higgs Boson Systems Pvt. Ltd. provides complete sales, installation, commissioning, application support, operator training, and after-sales service across India.</p>...

  • Wafer Mounter & Wafer Expander – Powatec
    <p>The <strong>Wafer Mounter & Wafer Expander</strong> from Powatec are precision-engineered solutions designed to optimize wafer preparation and die handling processes in semiconductor manufacturing. The Wafer Mounter securely laminates semiconductor wafers onto adhesive tape, ensuring stable support and protection during back grinding, dicing, and handling operations. The Wafer Expander uniformly expands diced wafers, increasing die spacing for accurate pick-and-place while minimizing chip damage and improving assembly efficiency. These systems deliver high precision, excellent repeatability, and reliable operation, making them ideal for IC packaging, MEMS, power semiconductors, LEDs, optoelectronics, and advanced packaging applications. Higgs Boson Systems Pvt. Ltd. provides complete installation, commissioning, technical support, operator training, and after-sales service across India, helping manufacturers achieve higher productivity, improved yield, and consistent process quality.</p>...

  • Plasma Ashing & Photoresist Stripping System – Trymax Semiconductor Equip
    <p>The <strong>Plasma Ashing & Photoresist Stripping System</strong> from Trymax Semiconductor Equipment is designed to deliver high-performance dry plasma processing for semiconductor wafer fabrication and advanced packaging applications. The system efficiently removes photoresist residues after lithography while ensuring excellent wafer surface integrity and process uniformity. It supports plasma ashing, descum, surface activation, plasma cleaning, and residue removal processes, enabling higher device reliability and improved manufacturing yield. Engineered for high throughput, precise process control, and low cost of ownership, Trymax solutions are ideal for semiconductor fabs, OSAT facilities, MEMS manufacturing, power semiconductor devices, RF components, sensors, and advanced packaging technologies. Higgs Boson Systems Pvt. Ltd. provides complete application support, installation, commissioning, operator training, preventive maintenance, and after-sales service throughout India.</p>...

  • High-Precision Industrial Inkjet Printing System – Notion Systems GmbH
    <p>The <strong>High-Precision Industrial Inkjet Printing System</strong> from Notion Systems GmbH is an advanced digital deposition platform designed for semiconductor manufacturing, wafer-level packaging, MEMS, photonics, and microelectronics applications. The system enables highly accurate, non-contact deposition of functional materials, photoresists, dielectric inks, conductive inks, adhesives, and other specialty fluids directly onto wafers and substrates. Its maskless printing technology reduces material waste, shortens development cycles, and provides exceptional flexibility for both R&D and high-volume manufacturing. Engineered for micron-level precision and outstanding process repeatability, the system supports advanced packaging, panel-level processing, sensors, displays, and optoelectronic device fabrication. Higgs Boson Systems Pvt. Ltd. provides complete sales, application engineering, installation, commissioning, operator training, and after-sales support across India, enabling customers to achieve superior process accuracy and manufacturing efficiency.</p>...

  • Fine & Heavy Wire Bonding System – Hesse Mechatronics
    <p>The <strong>Fine & Heavy Wire Bonding System</strong> from Hesse Mechatronics is a high-performance bonding solution designed for precision semiconductor packaging and advanced electronic assembly. The system supports ball bonding, wedge bonding, ribbon bonding, and heavy wire bonding using gold, aluminum, and copper wire for a wide range of semiconductor and power electronics applications. Engineered with advanced ultrasonic bonding technology, intelligent process control, and high-accuracy motion systems, it delivers exceptional bond quality, repeatability, and production efficiency. Hesse wire bonders are widely used in semiconductor packaging, IGBT and SiC power modules, automotive electronics, MEMS devices, sensors, LED packaging, and hybrid microelectronics. The modular platform enables flexible production and reliable operation for both R&D and high-volume manufacturing. Higgs Boson Systems Pvt. Ltd. offers complete application support, installation, commissioning, operator training, preventive maintenance, and comprehensive after-sales service throughout India.</p>...

  • Electron Beam Welding (EBW) System – Cambridge Vacuum Engineering
    <p>The <strong>Electron Beam Welding (EBW) System</strong> from Cambridge Vacuum Engineering (CVE) is a state-of-the-art vacuum welding solution designed for high-precision joining of critical components across semiconductor, aerospace, automotive, medical, defense, and advanced manufacturing industries. Using a focused high-energy electron beam in a vacuum environment, the system produces deep, narrow, and high-integrity welds with minimal heat-affected zones and exceptional dimensional accuracy. It is ideal for welding dissimilar materials, precision components, battery assemblies, vacuum chambers, sensors, and high-value electronic devices. Equipped with advanced CNC motion control, real-time process monitoring, and automated welding capabilities, CVE's EBW systems ensure consistent quality, superior productivity, and reduced manufacturing costs. Higgs Boson Systems Pvt. Ltd. provides complete solution consulting, installation, commissioning, application development, operator training, and comprehensive after-sales support across India.</p>...

Categories

200 Packaging and Assembly Equipment
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Ball Placement; Attach Systems
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Device Handling; Feeding Systems
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Dispensing Systems
  • Lead Finishing; Straightening Equipment
  • Lead Frame Taping Systems
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
  • Marking; Imprinting; Labeling Equipment
  • Molding; Encapsulation; Decapsulation Equipment
  • Solder Reflow; Soldering & Brazing Equipment
  • Tape Automated Bonding (TAB); Bumped Tape Automated Bonding (BTAB) Equipment
  • Wafer Level Bonders
  • Wafer Mount; Taping Equipment
  • Wire Bonding Equipment
    • 201 Flat Panel Display Equipment
  • Scribe and Break Equipment
    • 202 Other Equipment
  • Welding Equipment
    • 203 Inspection & Measurement Products
  • Die Inspection; Die Shear
  • Package Inspection; Lead Scanners
  • Stress; Refractive Index; Reflectivity & Conductivity Measurement
  • Wire Bonding Inspection; Test
  • X-ray; XRF; 3-D X-Ray; LEXES Systems
    • 204 MEMS Equipment
  • Deep RIE etching; Dry Etching
  • Wafer Level Bonders
    • 206 PV Equipment
  • Thin Film
  • Wafers
    • 207 Process Equipment
  • Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment
  • Coat; Develop; Resist Processing; Track Equipment
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
  • Epitaxy Equipment; Epi Reactors; Molecular Beam Epitaxy (MBE); Atomic Layer Epitaxy (ALE)
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Ion Implantation Equipment
  • Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
  • Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment
    • 208 Test Equipment
  • Optical Test Systems
  • Package Test Systems
    • 300 Packaging and Assembly Materials
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
    • 700 Manufacturing Services
  • Deposition Service
  • Etch; Strip; Cleaning Service
  • Ion Implant Service
  • Lithography; Patterning service
  • Measurement; Inspection Service

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