Kyoritsu Electric India Pvt. Ltd.

Plot No.10, India Land Global Industrial Park,
Hinjewadi, Phase 1
Pune,  MH  411057

India
http://www.kyoritsuelectric.com
  • Booth: H7002

Kyoritsu Electric India brings over 25 years of expertise in delivering end-to-end solutions for SMT manufacturing, PCBA Testing, Automation and Peripheral equipment- all under one roof. Kyoritsu Electric India established as a 100% Subsidiary of Kyoritsu Electric Corporation & Kyoritsu Test System-JAPAN, for marketing, sales & after-sales global support of their state-of-the-art PCBA In-Circuit Testers & Function testers. Kyoritsu Electric India is also one of the prominent manufacturers & suppliers of ICT Test Jigs & Function Test Jigs with highly sophisticated & modernized infrastructure for in-house jig manufacturing. Kyoritsu has built a strong cluster of leading technology companies focused on providing complete solutions for the semiconductor backend manufacturing process. These companies specialize in their respective domains and are recognized for high-quality products, advanced packaging technologies, precision engineering and reliable manufacturing solutions. Our portfolio includes solutions related to: Semiconductor assembly and packaging equipment Semiconductor testers and handlers Trimming & forming systems Precision tooling and molds Precision laser marking systems Automation and material handling systems Electroplating, etching and vision inspection systems

Categories

200 Packaging and Assembly Equipment
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Die Removal Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Dispensing Systems
  • Lead Frame Taping Systems
  • Marking; Imprinting; Labeling Equipment
  • Molding; Encapsulation; Decapsulation Equipment
  • Package Handling; Conveying Equipment
  • Plating; Electro Chemical Plating for device assembly
  • Wafer Level Bonders
  • Wire Bonding Equipment
    • 203 Inspection & Measurement Products
  • Package Inspection; Lead Scanners
  • Wire Bonding Inspection; Test
    • 204 MEMS Equipment
  • Wafer Level Bonders
    • 207 Process Equipment
  • Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment
  • Plating; Electro Chemical Plating; Deposition Systems
  • SOI Bonders; Temporary Bonders; De-Bonders
    • 208 Test Equipment
  • Discrete Component Test Systems
  • Failure Analysis Systems
  • Functional Test Systems
  • Handlers; Positioner Systems
  • Optical Test Systems
  • Package Test Systems
  • Printed Circuit Board; Wire Board (PCB or PWB) Test and Repair
  • Probe Card Maintenance and Analysis Systems
    • 300 Packaging and Assembly Materials
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Molding; Encapsulation; Potting; Resin Materials
  • Scribe Tools; Saw or Dicing Blades and Accessories
  • Solder; Solder Balls and other Soldering Materials
    • 307 Process Materials
  • Plating Materials

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