Nitto Denko India Pvt Ltd
Welcome to Nitto Denko – a global leader in innovation and quality for the semiconductor industry. We are proud to present our comprehensive range of Semiconductor Tapes tailored for Backgrinding, Dicing, Die Attach Film (DAF), and Lead Frame Taping. These advanced solutions are designed to support the evolving needs of high-precision semiconductor manufacturing, offering excellent performance, stability, and protection throughout each process step.
Our state-of-the-art NEL (Nitto Equipment Line) machines seamlessly integrate with our tapes, delivering unmatched automation, accuracy, and process efficiency. These systems are engineered to optimize productivity while maintaining the highest standards in yield and device integrity.
At Nitto, we continue to push the boundaries of technology with cutting-edge innovations, including our next-generation ultra-thin wafer handling solutions. These innovations are built to meet the growing demands of miniaturization, enabling reliable processing of ultra-thin wafers with enhanced protection and minimal stress.
Partner with Nitto Denko for trusted quality, pioneering technology, and a future-focused approach in semiconductor solutions.