Maxell’s Advanced SLIONTEC Tape Series for Semiconductor Manufacturing
Maxell proudly introduces its latest lineup of high-performance adhesive tapes
designed specifically for semiconductor wafer and package dicing, as well as back
grinding protection. The SLIONTEC series—comprising the No.636000 Dicing Tape for
wafers, No.636015 Dicing Tape for packages, and No.635249 Back Grinding Tape—
oRers cutting-edge solutions to enhance precision, yield, and environmental safety in
semiconductor manufacturing processes.
No.636000 Dicing Tape (for Wafer)
This tape features a higher isotropic olefin backing combined with a UV peeling
adhesive, optimized for various wafer dicing applications. It delivers strong adhesion
(2.80 N/10mm) and excellent holding power under heat (40℃), ensuring wafers remain
securely fixed during processing. The environmentally sensitive adhesive contains no
solvents and is free from toluene/xylene, supporting cleaner manufacturing
environments. The tape’s design allows full usage to the end, reducing material waste
and rejects.
No.636015 Dicing Tape (for Package)
Tailored for package dicing, this tape shares the same advanced backing and UV
peeling adhesive technology as the wafer tape. It provides consistent adhesion and
holding power, facilitating reliable fixation of packages during dicing. Its solvent-free,
eco-friendly adhesive composition enhances safety and sustainability in production
lines. The tape’s standard type classification makes it a versatile choice for diverse
package dicing needs.
No.635249 Back Grinding Tape
Designed to protect bumped wafers during back grinding, this tape prevents dimples
and wafer damage with its high conformity to bumps approximately 300μm in diameter.
Available in UV and non-UV types, the non-UV version features an initial adhesion of
0.25 N/10mm, ensuring secure wafer protection without compromising surface
integrity. Like the dicing tapes, it employs an environmentally sensitive adhesive free
from harmful solvents.
Common Benefits Across the SLIONTEC Series
• Environmentally sensitive adhesives with no solvents, toluene, or xylene
• High adhesion and holding power for secure fixation
• Full tape utilization to minimize waste and rejects
• Clear application guidelines to ensure optimal performance
• Designed to meet demanding semiconductor manufacturing standards
Maxell’s SLIONTEC tapes represent a significant advancement in adhesive technology
for the semiconductor industry, combining performance, environmental responsibility,
and cost-eRiciency. These products support manufacturers in achieving higher yields
and improved product quality while adhering to stricter environmental regulations.
For more information on Maxell’s SLIONTEC tape series and technical support, please
visit Maxell’s oRicial website.
https://biz.maxell.com/en/sliontec_tapes/