Toho international Inc.

Orix Honmachi bldg. 17F, 1-4-1, Nishihonmachi, Nishi-ku
Osaka,  Osaka  5500005

Japan
https://toho-intl.co.jp/en/export-product/category/semiconductor/
  • Booth: 234

Test with Confidence —"World-Class Japanese Semiconductor Testing Products" We offer high-quality, one-stop semiconductor testing solutions, including Test sockets, contact probes, and probe cards and so on to customers around the world. We support this with exceptional service, fast and reliable logistics, and local assistance through our office in Bangalore, India.


 Products

  • Customized Test Socket
    <p>We deliver a comprehensive lineup of high-performance, customized IC test sockets, meticulously engineered to meet the evolving demands of modern semiconductor packages. All sockets are designed and manufactured entirely in-house, enabling rapid customization, consistent quality, and reliable delivery.</p><p><br />Our IC test socket solutions are compatible with a wide range of package types, including QFP, QFN, BGA, FBGA, WLCSP, and other advanced semiconductor packages.</p><p><br />Our solutions support both manual and handler-type applications, providing seamless flexibility across development, qualification, and high-volume production environments.<br /><br /> </p>...

  • Spring Contact Probe
    <p>We provide a comprehensive contact probes designed to serve as a versatile solution for engineers performing critical reliability and performance evaluations, supporting every phase from initial design to mass production.</p><p>Our technology is highly adaptable, offering products that are customizable on over 1,000 specifications to meet the unique requirements of any testing application.</p><p>We specialize in advanced probing architectures, including Kelvin and coaxial Kelvin probes for precision power testing,<br />as well as ultra-fine-pitch solutions for high-density inspections.</p><p>For specialized validation, our lineup includes high-frequency probes optimized for signal integrity in RF environments<br />and heat-resistant “Dragon Probes” designed for stable measurement at elevated temperatures. By leveraging proprietary plating technologies and high-performance alloy materials, we ensure our probes deliver the reliability and electrical performance essential for verifying the next generation of semiconductor designs.</p>...

  • Lead Frame and EDM wire
    <p><strong>Lead Frame</strong></p><p>We provide high-precision lead frames designed to facilitate the support, heat dissipation, and external connectivity of semiconductor chips.</p><p>Our products are engineered with the mechanical strength required to protect components from physical stress<br />while maintaining the high electrical and thermal conductivity necessary for efficient performance.</p><p>Our lead frames are manufactured with materials such as Copper Alloys and Nickel Alloys like Alloy 42 for high-reliability applications. Our manufacturing capabilities include both precision stamping for high-volume production and chemical etching for intricate, high-density designs</p><p> </p><p><strong>EDM Wire  Precision Redefined for Lead Frame Manufacturing</strong><br />We provide the SumiSpark γ EDM wire, a solution specifically engineered to meet the uncompromising requirements of lead frame production. By leveraging a high-carbon steel wire core paired with a proprietary special alloy coating, we deliver a product that balances high-tensile strength with exceptional electrical discharge performance.</p><p>In the semiconductor industry, precision is the ultimate priority; therefore, our wire is available in ultra-fine diameters ranging from 0.03mm to 0.10mm. These specifications facilitate high-speed, ultra-precise processing while maintaining the critical stability needed for intricate lead frame geometries. Choosing our EDM wire ensures a more efficient production cycle, superior surface finishes, and the reliability required for next-generation electronic components.</p>...

  • Probe Card Pins
    <p><span style="color:rgb(41,41,41);">We provide high-precision tapered probe card pins engineered for the most demanding semiconductor testing requirements.</span>  <span style="color:rgb(41,41,41);">By utilizing a proprietary mechanical grinding process instead of conventional etching, we achieve superior tip accuracy and the ability to process specialized precious metal materials including Tungsten (W), Rhenium Tungsten (ReW), Palladium Alloy (Pd), and Beryllium Copper (BeCu). Our fully integrated in-house production covering everything from wire drawing and heat treatment to final bending and allows us to deliver custom-tailored solutions with optimized material properties for maximum reliability and performance.</span></p><figure class="image"><img src="https://toho-intl.co.jp/en/wp-content/uploads/sites/2/2026/02/ad9489ad12ed1855b66752104aa73657.jpg" alt="ad9489ad12ed1855b66752104aa73657.jpg" /></figure><figure class="image image-style-align-left image_resized" style="width:51.96%;"><img src="https://toho-intl.co.jp/en/wp-content/uploads/sites/2/2026/02/56b94f35b2de057fadf36953f5cb25d5.jpeg" alt="56b94f35b2de057fadf36953f5cb25d5.jpeg" /></figure>...

  • Probe Card
    <p>We provide a comprehensive range of high-performance probe cards and probe heads designed to act as the critical interface between test equipment and semiconductor wafers. Our solutions support diverse validation and mass production requirements,  offering advanced Vertical Probe Cards and integrated probe head assemblies for high-density testing that minimize pad damage and improve parallelism.</p>...

  • PCB & PCBA Testing products
    <p><mark class="marker-yellow"><strong>Wire Probes</strong></mark></p><p>Designed for fine-pitch chip, IC pacakages and wafer inspections, ultra-fine wire probes enable high-precision testing in tight spaces where standard pins fail. Featuring 0.02mm–0.110mm diameters and lengths down to 4.5mm, they use specialized Tungsten, BeCu, and Pd alloys to ensure low, stable contact resistance and high oxidation resistance.</p><figure class="image image_resized image-style-align-center" style="width:42.84%;"><img src="https://toho-intl.co.jp/en/wp-content/uploads/sites/2/2026/02/fb61dddc31d9384b0d3169f3b98224bc.jpeg" alt="fb61dddc31d9384b0d3169f3b98224bc.jpeg" /></figure><p><mark class="marker-yellow"><strong>Jumper Wire</strong></mark></p><p>Jumper wires act as flexible, short-cut connections on printed circuit boards, allowing electricity to bypass standard wiring to bridge remote parts of a circuit. By simply adding or detaching these conductors, engineers can control power, turn specific functions on or off, repair damaged board traces, and easily test design updates without the high cost of manufacturing a completely new PCB.</p><figure class="image image_resized image-style-align-left" style="width:26.66%;"><img src="https://www.showa-seisen.co.jp/img/jumperline/img-jumperline-04.png" alt="ジャンパー線 - 銅線材加工・溶融メッキ(めっき)の昭和製線株式会社" /></figure><figure class="image image_resized image-style-align-left" style="width:32.18%;"><img src="https://www.showa-seisen.co.jp/img/jumperline/img-jumperline-01.png" alt="What is a jumper wire?" /></figure><p> </p><p> </p><p> </p><p> </p><p> </p><p> </p>...


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