Zestron Surface Technology Solutions India Private Limited
Visit ZESTRON at SEMICON India – Booth H5829
Discover how ZESTRON is enabling the next generation of semiconductor manufacturing through advanced cleaning and surface conditioning technologies. As a global leader in precision cleaning solutions, we help OSATs, IDMs, EMS providers and their supply chain eliminate surface contamination, improve manufacturing yields and achieve the stringent cleanliness and reliability requirements of advanced electronic assemblies.
Our application-specific solutions support SMT, Power Electronics, and Advanced Packaging, including SoP, Flip Chip, Ball Attach, SiP, 2.xD, stacked 3D packages, Chip-on-Wafer (CoW), wafer bumping and high-power devices. Our advanced chemistries are engineered for critical cleaning, surface conditioning, and oxidation control to enable robust, high-reliability manufacturing processes.
Visit Booth H5829 to meet our technical experts and learn how ZESTRON can support your process development, qualification and production requirements. Explore our capabilities in customer-specific cleaning trials, process optimization, analytical testing and reliability evaluation backed by our Bangalore Technical Center which is equipped with state-of-the-art cleaning equipment and analytical capabilities. Supported by a local engineering team with over 15 years of industry experience, we work closely with customers to solve complex manufacturing challenges and develop reliable, production-ready cleaning processes.
Whether you're introducing a new package, optimizing an existing process, or addressing critical cleanliness and reliability challenges, visit ZESTRON at Booth H5829 to discover practical solutions that improve manufacturing performance, product reliability and time-to-market.