The Innolas IL 1000 WMA series laser system is designed to mark various wafer materials with diameters ranging from 2“ to 200mm.
Different laser types and setups are available to achieve optimum process results for various materials such as Si, GaAs, Ge, SiC, GaP, InP, Sapphire, Quartz and others.
A deep or debree free marking process is available. Our application engineers are happy to help you with the best process setup.
The wafer marking system is controlled by a 19“ industrial PC. The powerful WindowsTM based software package includes user friendly operator and engineer interface along with sophisticated diagnostic features for maintenance and service personal.
Software options include wafer sorting and SECS/GEM host interface. Customized software solutions are available upon request.