Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Fraunhofer IZM-ASSID provides prototyping and low-volume manufacturing
services (300/200 mm) at its advanced pilot line for wafer-level packaging.
Fraunhofer IZM-ASSID has established strong cooperation with leading material
and equipment suppliers in which customer-specific solutions in the fields of
material, equipment and processes are developed and introduced into products.
As a member of the Fraunhofer Cluster 3D Integration and Research Fab Microelectronics Germany, Fraunhofer IZM-ASSID
offers – together with its Fraunhofer partners – fully customized support for 3D
integration including design, technology and reliability. The pilot line is certificated
according ISO 9001.
初出展/New Exhibitor No
新製品/New Products Yes
製品展示/Displaying Equipment Yes
デモンストレーション/ Product Demonstrations No
産業・技術分野/ Industries/Technologies MEMS, プラスチック/有機/プリンテッドエレクトロニクス/Plastic/organic/flexible electronics, 半導体/Semiconductor