CoreFlow’s chuck can clamp the wafer’s front side (active area) while a process such as polishing/grinding, is applied on the back
Product features and benefits are as follows:
- High precision Pressure/Vacuum contactless forces resulting in minimal backside contamination.
- High air gap stability (±20nm) supporting high resolution inspection.
- Inherent mechanical and thermal decoupling means that the wafer is practically isolated from any source of noise.
- High Pressure Vacuum clamping force keeps the wafer still at a very precise flight height.
Coreflow chuck can be applied to any wafer size and is practically orientation free.