MSP Corporation

Shoreview,  MN 
United States
http://www.tsi.com
  • 小間番号2465


Visit MSP's booth (#2465) and meet our experts!

MSP, a Division of TSI, offers a complete line of liquid source vaporization products for thin film deposition as well as Particle Deposition Systems for use in Semiconductor Manufacturing.

Vaporization Products

MSP provides three key components of a vaporization system: vaporizers, vapor process gas filters, and liquid flow controllers.

Vaporizers are used in gas phase processes to transition a liquid into a gas for thin film deposition or other processes that require a vapor (metal etch, doped epitaxial growth, etc.). Vaporizers are widely used in CVD & ALD processes.

MSP’s Turbo-Vaporizers™ use a unique nano-droplet vaporization, direct liquid injection (DLI) technique. MSP's exclusive technology offers a broad range of advantages over older, more conventional techniques. This market-proven technology provides:

  • Extremely stable concentration output
  • Clog free operation/Longer lifetimes
  • Higher vapor concentration potential/wider process window
  • Ability to vaporize difficult precursors: thermally sensitive or low vapor pressure

In thin film applications, our Turbo-Vaporizers’ stable and uniform vapor leads to a higher quality thin film and higher wafer yields with less down time. MSP’s Vaporizers provide faster response time, high precision flow control, and are able to operate at high temperatures.

Particle Deposition Systems

MSP's 2300G3 Particle Deposition System deposits PSL spheres, MSP’s NanoSilica™ Size Standards, and other SiO2 particles to produce wafer calibration standards with SI traceability. These standards calibrate and qualify your wafer inspection tools for use in semiconductor device manufacturing. Deposited particle size and count are controlled with precision, accuracy, and repeatability so the calibration standards are consistent from substrate to substrate. Our particle deposition systems offer:

  • Full (blanket), Spot, Arc, and Ring deposit patterns
  • Precise recipe control of deposited particle size
  • Nanoparticle atomization for clean particle generation down to 10nm
  • Differential Mobility Analyzer (DMA) size classification for narrow size distribution selection
  • Minimization of particle clusters and residue particles
  • Recipe control of deposit pattern width
  • Recipe, deposition, and suspension analysis reports
  • Ergonomic design
  • Worldwide service and support


 出展製品

  • Turbo-Vaporizers
    MSP's Turbo-Vaporizers’ stable and uniform vapor leads to a higher quality thin film and higher wafer yields with less down time. MSP’s Vaporizers provide faster response time, high precision flow control, and are able to operate at high temperatures....

  • Develop the Next Breakthrough

    Used world-wide, MSP's Turbo-Vaporizer transitions liquids into gases so they can be used for gas phase processes. This vapor deposition tool is ideal for any application which requires a high quality, stable vapor. They are used primarily in thin film deposition by:

    • CVD
    • PECVD
    • MOCVD
    • ALD

    Additionally, our vapor deposition tool provides very uniform thin films for diamond-like coatings (DLC) and SiC-based applications.

    This direct liquid injection vaporizer (DLI Vaporizer) uses a droplet atomization technique. The Turbo-Vaporizer™ design applies advanced aerosol science and thermo-dynamics to create a more precise solution for liquid source vaporization.

    While other vaporizers have difficulty vaporizing thermally sensitive liquids or liquids with low vapor pressure, MSP's Turbo-Vaporizer successfully vaporizes them with a very stable concentration output and easily adjustable liquid flow rates. It also features a wider process window, producing lower and higher vapor concentrations than other vaporizers.

    Our Performance Enhanced (PE) Turbo-Vaporizers provide even higher performance and increased precision to vaporize your liquid precursors. It:

    • Reduces atomized droplet size
    • Increases thermal efficiency
    • Reduces response time
    • Eliminates liquid bubble formation
    • Increases process options
    • Lowers maintenance costs
    • Reduces downtime

    MSP’s vapor delivery systems more completely vaporize your liquid precursors, leading to more uniform thin film depositions, denser films, and films with more resistance to plasma-induced damage. Our systems are able to vaporize liquid precursors that are too difficult to vaporize by other methods (such as thermally sensitive materials, and materials with low vapor pressure) - including CCTBA, TEMAZr and TEMAHf molecules.

  • Liquid Flow Controllers
    Liquid Flow Controllers modulate how much liquid enters a vaporizer, and in turn regulate the concentration of the vapor. MSP’s versatile Liquid Flow Controller can be used to control the on-board Piezo valve in PE vaporizers....

  • MSP’s thermal liquid flow controllers can be used to control the on-board Piezo valve in our PE Vaporizers. They can maintain a steady liquid flow, or generate repeatable short duration vapor pulses for ALD (atomic layer deposition) applications.

    Our liquid flow controllers feature an all-digital control system resulting in response times of <200ms making the 2940 a great choice for ALD applications. They support zoned PID settings, and have a self-learning function to optimize control.

    Key Features and Benefits:

    • Supports Zoned PID settings
    • Has a self-learning function to optimize control
    • Response time of < 200 ms
    • 3 models that cover a liquid flow rate range from 0.08g/min (H2O) to 32 g/min (TEOS)
  • Vapor Process Gas (VPG) Filters
    MSP’s Vapor Process Gas Filters (vital piece of the vaporizing system) remove nanometer and micron-sized particles from a gas/vapor mixture using a carrier gas, stopping unwanted particles from mixing with chemical precursor vapor in ALD/CVD applications....

  • MSP’s patent-protected specialized VPG filters were designed to have an extremely low pressure drop, making it easier to work in an ultra-low pressure environment and reducing the risk of gas phase reactions occurring in the filter.

    MSP’s vapor/gas filters are chemically and thermally resistant, have a long filter life, and provide up to twelve 9s of efficiency at 2.5 nm (99.9999999999% @ 1 standard L/min).

    Tubing and components downstream of the vaporizer need to be heat-wrapped to prevent condensation. The solid stainless steel core in our cross-flow design filters provides additional heat exposure acting as a second stage heat exchanger.

    The Nano-Filtration Media used in our VPG-A6 is comprised of sintered stainless steel fibers of a homogeneous construction with efficiency and pressure drop capabilities not previously attainable by conventional sintered powder media construction.

  • Particle Deposition Systems
    MSP’s 2300G3 Particle Deposition System sets the standards for wafer inspection and metrology equipment. This advanced tool is vital for increasing the yield of future leading-edge devices, while meeting the measurement needs of today....

  • The 2300G3 Particle Deposition System deposits PSL spheres, MSP’s NanoSilica™ Size Standards, and other SiO2 particles to produce wafer calibration standards with SI traceability. These standards calibrate and qualify your wafer inspection tools for use in semiconductor device manufacturing.

    Deposited particle size and count are controlled with precision, accuracy, and repeatability so the calibration standards are consistent from substrate to substrate.

    The Model 2300G3 also deposits particles generated from MSP Process Particles™ Suspensions to help characterize the material dependence of inspection/metrology tool response to defects.

    Features and Benefits

    • Full (blanket), Spot, Arc, and Ring deposit patterns
    • Precise recipe control of deposited particle size
    • Nanoparticle atomization for clean particle generation down to 10nm
    • Differential Mobility Analyzer (DMA) size classification for narrow size distribution selection
    • Minimization of particle clusters and residue particles
    • Recipe control of deposit pattern width
    • Recipe, deposition, and suspension analysis reports
    • Ergonomic design
    • Worldwide service and support

    Applications

    MSP’s 2300G3 Particle Deposition System meets today’s measurement applications, including:

    • Traceable inspection system calibration
    • Matching legacy wafer calibration standards
    • Incoming bare wafer inspection/qualification
    • Determining inspection sensitivity for proprietary films
    • Blanket film monitoring
    • Inspection tool development and qualification
    • Process tool qualification, process learning and monitoring
  • Deposition Calibration Standards
    High-quality surface defect calibration standards improve overall inspection system performance and reduce inconsistencies within inspection tool fleets. MSP’s calibration standards are leaders in consistent/repeatable particle size and count control....

  • MSP provides certified Wafer and Photomask (Reticle) Calibration Standards for calibrating, qualifying, and monitoring wafer and photomask inspection systems. Particles of specified size, composition, and count are deposited on your substrate of choice, including wafers, 6-inch photomasks (any type), or HDD disks. Particles can be deposited on bare, film, and patterned wafers from 100mm to 450mm.

    Our Differential Mobility Analyzers (DMA) precisely control the mode (peak) of, and variation in, deposited particle diameter. DMAs are calibrated with SI traceability using the best available particle size reference materials, including PSL spheres from NIST.

    MSP’s particle size (10nm to 20μm) and count (400 to >100,000 particles per deposit) are extremely repeatable from substrate to substrate. Spot diameter (typically 10-30mm) and spot location are consistent from deposit to deposit (adjustable with sub-millimeter precision).

    Our quick substrate processing speed means your calibration standards are returned to you swiftly. The faster the turnaround, the shorter your learning cycle, and the faster your product can be developed.

    MSP’s Wafer and Photomask (Reticle) Calibration Standards meet today’s inspection and metrology applications, including:

    • Incoming bare wafer inspection/qualification
    • Process tool qualification and monitoring
    • Blanket film monitoring
    • Incoming photomask inspection/qualification
    • Production photomask monitoring
    • Inspection tool development and qualification