CoreFlow is a top provider of handling & conveying systems
CoreFlow is a world-class solution provider of high accuracy handling and conveying aeromechanical systems to the semiconductor and Flat Panel Display (FPD) industries. CoreFlow develops, manufactures and markets its products to equipment manufacturers and end-users in these industries. With more than 800 installations worldwide, CoreFlow’s handling platforms can be found on the production floors of many top FPD manufacturing fab plants, such as Samsung, LG, Sony, and more. In these fabs, CoreFlow products reliably handle the glass substrates.
The heart of CoreFlow’s technology is SmartNozzle™. This unique Nozzle enables the precise floating of the processed substrate.
In the FPD market, CoreFlow’s non-contact air floating systems transport substrates (glass or/and wafer) of any size, thickness, and weight (including the latest G10.5 and 0.1 mm thicknesses), between and within process systems with the utmost air-gap accuracy.
In the semiconductor market, CoreFlow products can be found inside inspection and material characterization machines.
Driven by the SmartNozzle™, CoreFlow’s selective vacuum solution addresses the challenges of handling warped wafers. Utilizing this self-controlled nozzle technology, CoreFlow’s handling mechanism acquires the wafer even when only a fraction of the vacuum array is covered.
CoreFlow’s wide range of products brings several decades of combined aeromechanical expertise to deliver manufacturing solutions with unmatched quality, accuracy, and stability – solutions that minimize your risk and maximize your manufacturing yield and throughput. CoreFlow’s headquarters and research facilities are based in Israel, with sales representatives located in Germany, Korea, Japan, Taiwan, and China.