Winning Team International Limited was founded in Hong Kong in 2016. We specialized in the packaging and testing business of high-power components, such as MOSFETs, IGBT, BJT, Schottky Diodes, Thyristors (SCRs), Power ICs, etc. Our products can be applied in different electronic devices. We strive to provide superior design, reliable production and quick response to our customers by continually developing new technologies, manufacturing new products and innovative solutions. The products we introduce to the market are tailored to the specific needs of our customers. Our main products included: DFN3030, DFN5060, SOT-223, TO-220, TO220F, TO-220FB, TO247, TO-252 and TO-263.
Our team formed by experienced top management and semiconductor experts. We are proud to have the full experience of semiconductor technology and operations. Our wafer suppliers have a professional production technology to meet our design for packaging technology. We apply our professional knowledge and experience to enhance product competitiveness.
Our mission is to create value for our customers, employees and shareholders, and to build a winning team.
Dimension : 5.0 X 6.0 X 0.8(mm)
Max Dice size : 4.06 X 3.625 (mm)
Wire Bonding : Copper & Aluminum Ribbon
Capacity : 10Million/month
>> ISO 9001:2015 and IECQ QC080000:2017 certified factory
>> 100% QC; meeting RoHS and REACH standards
Dimension : 3.2 x 3.1 x 0.8(mm)
Max Dice size : 2.43 x 1.78(mm)
Wire Bonding : Copper
Capacity : 20Million/month