Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Fraunhofer IZM-ASSID provides prototyping and low-volume manufacturing services (300/200 mm) at its advanced pilot line for wafer-level packaging. Fraunhofer IZM-ASSID has established strong cooperation with leading material and equipment suppliers in which customer-specific solutions in the fields of material, equipment and processes are developed and introduced into products.
As a member of the Fraunhofer Cluster 3D Integration and Research Fab Microelectronics Germany, Fraunhofer IZM-ASSID offers – together with its Fraunhofer partners – fully customized support for 3D integration including design, technology and reliability. The pilot line is certificated according ISO 9001.