Chung King Enterprise

Taoyuan, 
Taiwan
http://www.ckplas.com
  • 小間番号3345

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 出展製品

  • 200mm(8 inch) Shipping Box-PC
    Wafer Shipping Box has and bottomupper lid lid, use to deliver blank wafer from ingot to wafer factory, avoid wafer collision and contamination, not able to enter process. Stackable, dispatch after cleanliness....

  • ● Product name:8" Shipping Box-PC
    ● Part number:SH-B200-C
    ● Dimension:269.0 (L) x 291.0(W) x 239.0(H)mm
    ● Weight:2300g
    ● Capacity:25 PCS
    ● Wafer size:8 inch (Ø200mm)
    ● Material:PC/ PE / PTU
    ● Slot pitch:6.35mm

    Wafer Shipping Box 晶圓傳輸盒/晶圓載具
    Wafer Shipping Box 2"~8"

    Patent No.:
    Taiwanese Patent No.:M553052

  • 200mm(8 inch) PEEK Cassette
    PEEK Cassette-For general process. A container for loading wafers. Not easy to distort and high hardness. It can collocation with airtight storage box to protect wafer....

  • ● Product name:8" PEEK Cassette
    ● Part number:PK-C200
    ● Dimension:233.2(L) x 201.5(W) x 221.4(H)mm
    ● Weight:910g
    ● Capacity:25 PCS
    ● Wafer size:8 inch (Ø200mm)
    ● Material:PEEK ESD
    ● Slot pitch:6.35mm

    ● High hardness, not easy to distort, high temperature resistant
    ● Use to transfer inside factory
    ● Able to go with airtight Storage Box to protect wafer

    ● Choose Cassette:
    Material Degree of temperature resistance Property Application
    PP Cassette 40~60℃ Pros: Light weight, able to welding
    Cons: Distort easily
    For general transfer process
    PEEK Cassette 120℃ High hardness, not easy to distort, high temperature resistant
    PC Cassette 80~100℃ Light weight, able to welding
    PEI Cassette 130~150℃ Wear resistant, anti-static
  • FOUP CKH300 13slot (300mm/12 inch) for thin wafer
    CKplas H300/H313 FOUP series of product line fully align with SEMI standard of automation interface, compatible with AMHS. Not only design for standard silicon wafer, but also for special thin wafer application....

  • ● Product name:CKH300 FOUP / CKH313 FOUP 
    ● Dimension:440(L) x 347(W) x 337(H)mm
    ● Capacity:25 PCS / 13 PCS
    ● Wafer size:300mm(12 inch)Wafer
    ● Material:Customized
    ● Slot pitch:10 mm  /  20mm

    300mm FOUP, Able to protect, deliver and store 300mm wafer, provide safe protection during delivery and storage. Reduce particle contamination of wafer, protect wafer from static electricity damage and then increase yield rate. 25 slots type uses for general wafer. 13 slots type can store glass carrier and Thin wafer.

    CKplas H300/H313 FOUP series of product line fully align with SEMI standard of automation interface, compatible with AMHS. Not only design for standard silicon wafer, but also for special thin wafer application, CK300 FOUP create mini-environment to protect valuable wafer for transfer and storage purpose.

    FOUP CK300 - front
    FOUP CK300 - front

    晶圓傳輸盒FOUP CK300 - back

    FOUP Door KeyFOUP Door Key

    FOUP
    前開式晶圓傳送盒CK313 前開式晶圓傳送盒CK313 前開式晶圓傳送盒CK300
    FOUP CKH313
    13 slot
    FOUP CKH313
    13 slot Back Support
    FOUP CKH300
    25 slot
    Ckplas could customize the product depends on customer’s requirements on different manufacturing process.
    Wafer Type Standard Version Wafer Thin Wafer 
    Process Type General Process Low Moisture Absorption Material General Process 
    Model H300-S1 H300-L1 H313-S1 H313-S2
    Capacity 25 slot 25 slot 13 slot 13 slot
    Weight     5.6kg 6.2kg
    Main Material PC ESD CBM ESD PC ESD PC ESD
    Rear Window See Through Window Black Window See Through Window Black Window With Back Support
    Temperature Tolerance ≦ 80°C ≦ 80°C
    Inflatable Raft Distance 160x250mm 160x250mm 
    RUN CARD v v v v
    RFID v v v v
     
    Wafer Type Thin Wafer   
    Process Type General Process Low Moisture Absorption Material High Temperature Process
    Model H313-S3 H313-L1 H313-L2 CK313HT
    Capacity 13 slot 13 slot 13 slot 13 slot
    Weight 6kg 5kg 6kg 6.6kg
    Main Material PC ESD CBM ESD CBM ESD PEI ESD
    Rear Window See Through  Window With Back Support Black Window Black Window With Back Support ESD Removable
    Airtight Black Window
    Temperature Tolerance ≦ 60°C ≦ 80°C ≦ 80°C ≦ 150°C
    Inflatable Raft Distance 160x250mm   160x260mm
    RUN CARD v v v x
    RFID v v v x
    Product Feature
    Heat resistant FOUP & Movable Window Heat resistant FOUP & Movable Window
    Heat resistant FOUP & ESD Removable Airtight Black Window
    Patent No.:
    Taiwanese Patent No.:I586597、M563421 、M528296、M588109
    Chinese Patent No.:CN204348693U、CN205609490U、 CN206259327U、CN208007736U、CN210654281U 、CN210654281U
    Korea Patent No.:20-0486265
  • Frame FOUP
    Store and protect wafer frames to prevent them from collision....

  • ● Product name:Frame FOUP
    ● Part number:CKF300
    ● Dimension:387.0(L) x 392.0(W) x 196(H)mm
    ● Capacity:13 PCS
    ● Wafer size:12 inch (Ø300mm) Wafer
    ● Material:PC ESD

    ● Airtight, Anti-static, Light weighted.
    ● Original equipment applicable, and AMHS applicable. E-rack automated storage.
    ● Top Flange high-strength materials, and anti-shock and wear resistance.

    Product name Wafer size Part number Capacity Difference
    Frame FOUP 12" CKF300 13 pcs

    Door with movable type

    Frame FOUP 8" CKF200 13 pcs

    ● Patent No.:
    Taiwanese Patent No.:M489156、M508114、M565877、M566707、M566903、M566905
    Chinese Patent No.:CN208400826U、CN208368484U、CN208538811U、CN208589423U
    USA Patent No. US10847394

  • Reticle SMIF Pod(RSP 150)-BKM7
    Reticle SMIF Pod(RSP 150)-BKM7, Contamination proof, assure safety of 6” photomask during transfer and storage between station and station....

  • ● Product name:Reticle SMIF Pod(RSP 150)-BKM7
    ● Part number:RSP-BKM7
    ● Dimension:226.92(L) x 229.8(W) x 91.6(H)mm
    ● Weight:1340g
    ● Capacity:1 PCS
    ● Mask size:6025 Mask(6 inch)
    ● Material:PEEK

    High cleanliness can prevent air contamination to ensure the safety of 6 inch reticle during transfer and storage between stations. It can be used in automation equipment. In addition, it is classified into N2 Purge and Non N2 Purge ( Gas inside the box can be more clean).

    *  Can be used in ASML、Nikon、Canon…and other related mask process, transfer equipment, are all having compatible product model