Pick&Place: this equipment is used to assemble different parts of power modules such as dice, lead frame, preform, and plastic case.
Pin Insertion: this equipment is used to place the pins on the substrated. It works for both wired (inserted) and coil pins (punched and soldered in the next phases).
Dispensing/vacuum potting: can be confired with glue, flux jet dispenser (with integrated optical check and UV curing), or SilGel dispenser (two components volumetric dispenser) with vacuum potting chamber.
Soldering/welding: according to the connection method, the equipment can be configured to perform Vacuum induction soldering or ultrasonic welding.
Laser Marking: this equipment is used to mark every single leadframe/AMB, and device, to allow each single unit traceability. The green Laser sources is the ultimate solution for a fast, and accurate marking on copper, silver, ceramic substrate and plastic case.