Beneq

ESPOO,
Finland
https://beneq.com/en/

小間番号5926

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出展製品

Beneq is the home of ALD. Welcome to our virtual booth!

Beneq is the home of atomic layer deposition. In 1984, we established the world’s first industrial production using ALD. Today, we lead the market with products for R&D (TFS 200, TFS 500), semiconductor device fabrication (TransformTM), 3D and batch production (P400A, P800, P1500), ultra-fast spatial ALD (C2R), and roll-to-roll ALD (Genesis).

Beneq’s unique Development Service simplifies customer adoption and proof-of-concept for new ALD processes, while our Coating Service cuts down time to market by outsourcing state of the art ALD production. Our team of engineers and experts is dedicated to making ALD tools accessible for researchers.

出展製品

Beneq Transform®

Beneq Transform® is a one-stop ALD cluster tool, combining thermal and plasma-enhanced processing for Power, LED, and other compound semiconductor device fabrication on up to 200 mm wafers.... More Info Less Info

Beneq Transform® establishes a completely new class of ALD cluster tool products with its versatility and adaptability to address a broad range of applications and market segments. With combined thermal and plasma-enhanced atomic layer deposition process modules, Beneq Transform® provides ALD solutions across several More-than-Moore device markets, including power devices, RF devices, MEMS, CMOS image sensors and photonics. The Beneq Transform® features 3 process modules with multiple configurations available, as well as the Beneq Transform® Lite option with 2 modules. With SECS/GEM communication and SEMI S2/S8 certification, Beneq Transform® is ready to serve More-than-Moore applications on up to 200 mm wafers.

Beneq Transform® 300

Beneq Transform® 300 combines thermal and plasma ALD in a 300 mm cluster tool for MtM applications including CIS, Power, MicroLED, and Advanced Packaging.... More Info Less Info

Beneq Transform® 300 is the only 300 mm ALD cluster tool combining thermal ALD (batch) and plasma ALD (single wafer) technologies to provide a highly versatile solution to IDMs and foundries. Beneq Transform® 300 is dedicated to a broad range of advanced thin-film applications from gate dielectric to anti-reflection coating, final passivation or encapsulation and beyond. Serving CMOS Image Sensor, Power, MicroLED, and Advanced Packaging device markets, it has SECS/GEM communication capabilities with SEMI S2 and S8 certifications. With a 200 mm bridge capability, Beneq Transform® 300 has the best flexibility available for production scale wafer manufacturing.

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Beneq

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