Spea

Volpiano, 
Italy
http://www.spea.com
  • 小間番号7722


Meet us at booths #7722 and #1520 and join our world.

Founded in 1976, SPEA is a global leader in the design and manufacture of advanced automatic test equipment (ATE) for testing MEMS, sensors, microchips, and printed circuit boards.
SPEA serves major semiconductor and electronics manufacturers around the world to conduct electrical and functional testing on their products before shipping them to customers. This ensures that the products are error-free and function properly in the long term.
Semiconductors are used in many digital consumer goods in everyday life, such as smartphones, laptops, digital cameras, televisions, credit cards, passports, washing machines, LED lamps and so on. The number of semiconductor components installed in cars is also constantly increasing. Smart features such as advanced driver assistance, self-driving cars and advanced in-car infotainment/navigation are enabled by integrating semiconductor technologies. One of the greatest areas of growth is currently occurring in the construction of Electric vehicles (EVS). Semiconductors play a crucial role here, especially in energy management like fast battery charging and increased travel range. These are just a few applications where SPEA offers test solutions for testing the semiconductor components as well as the end application circuit boards.
SPEA is headquartered in Italy, employs around 800 people worldwide and has subsidiaries in Germany, the USA, Mexico, China, Korea, and Singapore. SPEA is currently investing in opening new offices in Thailand, Malaysia, and the Philippines.


 出展製品

  • DOT800 - Multi-Core Analog Mixed Signal Tester
    DOT800 combines the capabilities of 2 testers into a single, test-head-only system. Its innovative device-oriented instrumentation incorporates all the resources for analog, digital, and signal processing in a single, powerful, configurable board....

  • DOT 800 is a multi-core analog mixed signal tester, offering test capabilities of two testers in a single, very compact system. Test capabilities address the requirements of a broad range of products: from MEMS and sensors to automotive devices, from PMIC’s to converters, LED drivers, 5G Devices, and more. 

     

    DOT800 is composed of two independent system cores, in less than 0,3 cubic meters. Each core is equipped with a dedicated CPU, to execute a test program in fully asynchronous mode, thus guaranteeing full parallel test efficiency.

     

    This architecture offers great advantages both in terms of time to market and test speed.

     

    Featuring up to 128 digital channels on a single instrument, the new channel option enables the DOT800 to perform high multi-site, cost-efficient testing of high-speed communication interface devices, which require a spread spectrum modulation on channels and clock signals to verify their signal integrity and robustness against EMI.

     

    DOT800 instrument architecture incorporates all the resources for analog, digital and signal processing in a single, powerful board for multi-site testing, including multiple control CPUs, DSP modules and programmable logic units. This configurable tester-in-a-board module allows you to populate DOT800 with one-type instruments, greatly simplifying system composition, programming and maintenance, while satisfying at best all the device test requirements – and go even beyond.

  • DOT800T - Power Semiconductor Tester
    DOT800T provides a complete solution for Power testing, combining on a single machine all the resources to perform ISO, AC, DC test on the whole range of power applications, from wafer level to final product test. ...

  • DOT800T provides a complete solution for Power testing, combining on a single machine all the resources to perform ISO, AC, DC test on the whole range of power applications. This tester is expressly designed to address the test requirements of traditional Silicon devices as well as new Gallium Nitride and Silicon Carbide technologies, covering their performance range with the highest voltage and current source capabilities, high frequency and low current measurement capabilities. 

     

    The correct device operation is verified under actual working conditions with complete and accurate dynamic tests, static test and isolation test sequences, to guarantee the quality and reliability of every device.

    All of this, in a high-throughput, modular and configurable tester, designed for mass- production environments.

     

    A multi-core architecture allows DOT800T to perform accurate static, dynamic and isolation tests on dedicated stations, each of which with a dedicated independent controller. The different test programs are performed in a true parallel, asynchronous mode, since each test core controller manages test resources, instrument connections, and test program execution.

  • MEMS Test Cells
    SPEA test cells for MEMS devices combine fast pick&place handling, reliable DUT contacting and complete final test capabilities, including electrical test, physical stimulus for functional test and calibration, and tri-temp thermal conditioning....

  • All MEMS Test Cell elements are designed and manufactured directly by SPEA. The test cell works as a single machine, performing test, handling and stimulus operations.
    Main advantages result in:
    • reduced costs, compared to solutions based on components from different suppliers
    • fast time to market
    • ease of use and maintenance, which means low cost of ownership
    • scalability and easy modification/extension of the equipment
    • High-throughput pick and place test handler (33,000+ UPH), specifically designed to perform gentle, fully automated handling of MEMS devices, without applying extra-force to the component. Components are picked up from trays or bowl feeder, wafer or strip on blue/UV tape, transferred to the test area and, at the end of the test, are placed on trays, reel or box
    • Stimulus units for testing inertial MEMS, environmental sensors (pressure, humidity, gas, temperature), TPMS sensors, magnetic and 9-DoF MEMS, optical sensors (proximity, ToF, UV sensors), MEMS microphones, with possibility of reconfiguration with different stimulus modules
    • Thermal conditioning, with an innovative nitrogen-less system