You are welcome at Boschman at the Holland High Tech booth.
Besides the development and supply of advanced equipment solutions we regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. We strongly believe that early involvement in the development process is a prerequisite to obtain the highest quality, reliable processes, the lowest cost of ownership and the shortest time to market.
We provide a unique one-stop-shop concept – from idea to industrialization – offering our customers one point of contact for all packaging activities. We consider ourselves to be a niche player, focused on well defined high growth market segments for Power Modules + MEMS & Sensors for the Automotive, Industrial, Mobile and Medical market.
With focus on technology leadership in Film Assisted Molding (encapsulation) and Ag sintering technology supported by our patented Dynamic Insert Technology we enable revolutionary package developments. Independent whether better performance, size reduction or cost reduction of a package is required we can support our customers achieving their goals.