ディスコ

大田区, 東京都
Japan
http://www.disco.co.jp

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DFD6363

精密切断装置「ダイシングソー」のΦ300 mmウェーハ対応フラッグシップモデル。ダイシングフレーム搬送仕様およびTwo-way(フレーム/ウェーハ単体）搬送仕様にオプション対応します。... More Info Less Info

DFD6363

Dicing saw for Φ300 mm wafers with high process extensibility... More Info Less Info

Compatible with both frame and two-way*(frame/wafer) transferring
- Various processes, including full cut and half cut, can be supported with only one DFD6363. Size conversion operations can be reduced, reducing human error. Supports both standard cassettes (Φ200 mm / Φ300 mm) and FOUP cassettes.
ABC (Auto Blade Changer)*
- This feature minimizes equipment downtime by automatically detecting the end of blade life and performing all operations from blade replacement to continuing processing in fully automatic operation. It also prevents potential human errors during blade replacement due to workpiece changes and is effective for improved traceability.
Basic function improvements
- DFD6363 offers improved usability through the adoption of a 19-inch monitor and highly visible GUI (Graphical User Interface). It also achieves reduced processing time by optimizing the axis operation through multiple-axis synchronous control. Can expect improved productivity with the improved NCS (Non-Contact Setup)* and stable processing with the mounted specially developed 1.8 kW spindle (60,000 min-1)

*Option