Heat generation is a serious issue in EVs, 5G communication systems, and data center servers, which are increasing year by year, as heat generation directly affects the performance and life of the equipment.
Therefore, it is necessary to improve the heat dissipation of the substrate itself on which the device is mounted.
In particular, DPCC™ enables thick copper wiring suitable for high current and high heat dissipation applications, and has features not found in conventional substrates, such as wiring thicknesses over 1,000 μm and the ability to form different thicknesses on the same wiring.